Thermal analysis and optimization of high power LED automotive headlamp cooling device

High power LED headlamp cannot operate normally and efficiently in case the maximum junction temperature exceeds 120 C. Therefore, it is essential to install external cooling device with excellent thermal management. A model based on plate-fin heat sink is presented, the heat transfer plates (HTPS) are added to bridge aluminum substrate and heat sink. And its thermal performance is evaluated compared with the one only installing heat sink. Results reveal the HTPS coupled with heat sink has a good cooling performance. In addition, the correlation between the junction temperature and the HTPS length is investigated. The optimum length is 47 mm. Furthermore, considerable simulation and experiment are conducted on the junction temperature variation subject to input power, ambient temperature, as well as the installation angle respectively. Finally, a fan is added based on the original device to enhance cooling. It indicates that the junction temperature decreases gradually with the presence of velocity air flow.