Tuning the thermal conductivity of silicon carbide by twin boundary: a molecular dynamics study

被引:9
作者
Liu, Qunfeng [1 ]
Luo, Hao [2 ]
Wang, Liang [1 ]
Shen, Shengping [1 ]
机构
[1] Xi An Jiao Tong Univ, Sch Aerosp, State Key Lab Strength & Vibrat Mech Struct, Xian 710049, Peoples R China
[2] Georgia Inst Technol, Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
基金
中国博士后科学基金;
关键词
molecular dynamics; silicon carbide; thermal conductivity; twin boundary; FINITE-TEMPERATURE PROPERTIES; THERMOELECTRIC FIGURE; NANOWIRES; SIMULATIONS; SCATTERING; CRYSTALS; DEFECTS; SYSTEMS; MERIT; MEMS;
D O I
10.1088/1361-6463/aa553d
中图分类号
O59 [应用物理学];
学科分类号
摘要
Silicon carbide (SiC) is a semiconductor with excellent mechanical and physical properties. We study the thermal transport in SiC by using non-equilibrium molecular dynamics simulations. The work is focused on the effects of twin boundaries and temperature on the thermal conductivity of 3C-SiC. We find that compared to perfect SiC, twinned SiC has a markedly reduced thermal conductivity when the twin boundary spacing is less than 100 nm. The Si-Si twin boundary is more effective to phonon scattering than the C-C twin boundary. We also find that the phonon scattering effect of twin boundary decreases with increasing temperature. Our findings provide insights into the thermal management of SiC-based electronic devices and thermoelectric applications.
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页数:8
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