Contacting InP based micro disk lasers on 200 mm Si wafers

被引：0

作者：

Mandorlo, F. ^{[1
,2
]}

Romeo, P. Rojo ^{[1
]}

Letartre, X. ^{[1
]}

Regreny, P. ^{[1
]}

Viktorovitch, P. ^{[1
]}

Mandorlo, F. ^{[1
,2
]}

Fedeli, J. M. ^{[2
]}

Grosse, P. ^{[2
]}

机构：

[1] Univ Lyon, INL, CNRS, UMR 5270,Ecole Cent Lyon, F-69134 Ecully, France

[2] CEA LETI, F-38054 Grenoble, France

来源：

2008 IEEE 20TH INTERNATIONAL CONFERENCE ON INDIUM PHOSPHIDE AND RELATED MATERIALS (IPRM) | 2008年

关键词：

optical interconnects; laser; micro-disk; electrical pumping; micro-electronics; silicon photonic; contacts; CMOS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Using die to wafer bonding of InP membranes onto silicon wafers, micro laser sources and their contacts can be fabricated in compliance with the CMOS microelectronics standard processes.

引用

页码：338 / +

页数：2

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