Effects of nitrogen addition on methane-based ECR plasma etching of gallium nitride

被引:25
作者
Jin, Z [1 ]
Hashizume, T [1 ]
Hasegawa, H [1 ]
机构
[1] Hokkaido Univ, RCIQE, Sapporo, Hokkaido 0608628, Japan
关键词
GaN; ECR; RIBE; CH4; in situ XPS;
D O I
10.1016/S0169-4332(01)00853-4
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The effects of nitrogen addition on methane-based ECR plasma etching of GaN were studied. The etch rate 30 nm/min and r.m.s.. roughness 2.6 nm were obtained when the GaN sample was etched by a methane-based gas mixture without N-2. The addition of N-2 gas resulted in a decrease of etch rate and a smoother etched surface. The r.m.s. roughness became less than 0.4 nm even only 1.5 seem N-2 gas was added to the mixture. In situ XPS measurements showed that, without N-2, heavy N-depletion took place on the etched surface, resulting in appearance of Ga metal on the surface. In contrast, the loss of N was compensated when the N-2 gas was added, and the etched surface approached the stoichiometric one with the increase of N-2 gas flow. This suppression of preferential loss of N was considered to be the main reason that improved the etched surface morphology. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:361 / 365
页数:5
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