Thermal Coupling Analysis in a Multichip Paralleled IGBT Module for a DFIG Wind Turbine Power Converter

被引:58
作者
Li, Hui [1 ]
Liao, Xinglin [1 ]
Zeng, Zheng [1 ]
Hu, Yaogang [1 ]
Li, Yang [2 ]
Liu, Shengquan [3 ]
Ran, Li [1 ,4 ]
机构
[1] Chongqing Univ, Sch Elect Engn, State Key Lab Power Transmiss Equipment & Syst Se, Chongqing 400044, Peoples R China
[2] State Grid Chongqing Elect Power Corp, Elect Power Res Inst, Chongqing 401123, Peoples R China
[3] Ganzhou Power Supply Co, State Grid Jiangxi Elect Power Corp, Ganzhou 341000, Peoples R China
[4] Univ Warwick, Sch Engn, Coventry CV4 7AL, W Midlands, England
基金
中国国家自然科学基金;
关键词
Doubly fed induction generator; junction temperature calculation; multi-chip paralleled IGBT module; thermal coupling impedance; wind turbine power converter; TEMPERATURE; OPERATION;
D O I
10.1109/TEC.2016.2614526
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
Thermal coupling between adjacent insulated gate bipolar transistor (IGBT) or diode chips is the result of nonuniform temperature distribution in a multichip IGBT module. This affects the junction temperatures and hence the total power loss predicted for the module. The study first investigates the impact of thermal coupling effect on the junction temperatures through a finite element method, and then develops a thermal coupling impedance model to represent such effects. The effect is shown to reduce with the distance exponentially. The model result agrees well with the test. The validated model is then used to predict the junction temperature swings during operational power cycling in a doubly fed induction generator wind turbine, showing the difference between the rotor and grid side converters. The model presented and the results obtained may be important for reliability evaluation and condition monitoring in the wind turbine power converters as well as in other multichip-paralleled power electronic systems.
引用
收藏
页码:80 / 90
页数:11
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