AlGaN-Channel Gate Injection Transistor on Silicon Substrate With Adjustable 4-7-V Threshold Voltage and 1.3-kV Breakdown Voltage

被引:23
作者
Zhang, Li [1 ]
Zhou, Hong [1 ]
Zhang, Weihang [1 ]
Dang, Kui [1 ]
Zhang, Tao [1 ]
Ma, Peijun [1 ]
Ma, Xiaohua [1 ]
Zhang, Jincheng [1 ]
机构
[1] Xidian Univ, Sch Microelect, Key Lab Wide Band Gap Semicond Mat & Devices, Xian 710071, Shaanxi, Peoples R China
关键词
AlGaN; GaN; gate injection transistors; E-mode; ELECTRON-MOBILITY TRANSISTORS; SI SUBSTRATE; HEMTS; METAL; LAYER;
D O I
10.1109/LED.2018.2838542
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report on demonstrating the first Al0.05Ga0.95N-channel enhancement-mode (E-mode) p-GaN gate injection transistors (GITs) with an adjustable threshold voltage (V-T) of 4-7-V by controlling the number of source-connected p-GaN bridges. To the best of our knowledge, it is the highest VT reported in p-GaN GITs. Comparing with GaN channel, the Al0.05Ga0.95N channel is used to minimize the polarization difference between channel layer and Al0.15Ga0.85N barrier layer and also increase the maximum affordable electric field of the channel so as to increase the VT and breakdown voltage. Combing with 4.3 mu m-thick buffer layer, E-mode GITs demonstrate an off-state breakdown voltage of 662, 770, 1034, and 1315 V at a gate-to-drain spacing of 5, 7, 11, and 19 mu m, respectively, showing the great promise of the AlGaN channel E-Mode GITs for future power electronics applications.
引用
收藏
页码:1026 / 1029
页数:4
相关论文
共 20 条
[1]   Gate-recessed normally-off GaN-on-Si HEMT using a new O2-BCl3 digital etching technique [J].
Burnham, Shawn D. ;
Boutros, Karim ;
Hashimoto, Paul ;
Butler, Colleen ;
Wong, Danny W. S. ;
Hu, Ming ;
Micovic, Miroslav .
PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 7, NO 7-8, 2010, 7 (7-8)
[2]   Analysis of the Back-Gate Effect in Normally OFF p-GaN Gate High-Electron Mobility Transistor [J].
Chiu, Hsien-Chin ;
Peng, Li-Yi ;
Yang, Chih-Wei ;
Wang, Hsiang-Chun ;
Hsin, Yue-Ming ;
Chyi, Jen-Inn .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2015, 62 (02) :507-511
[3]   Breakdown Enhancement and Current Collapse Suppression by High-Resistivity GaN Cap Layer in Normally-Off AlGaN/GaN HEMTs [J].
Hao, Ronghui ;
Li, Weiyi ;
Fu, Kai ;
Yu, Guohao ;
Song, Liang ;
Yuan, Jie ;
Li, Junshuai ;
Deng, Xuguang ;
Zhang, Xiaodong ;
Zhou, Qi ;
Fan, Yaming ;
Shi, Wenhua ;
Cai, Yong ;
Zhang, Xinping ;
Zhang, Baoshun .
IEEE ELECTRON DEVICE LETTERS, 2017, 38 (11) :1567-1570
[4]  
Hilt O, 2011, PROC INT SYMP POWER, P239, DOI 10.1109/ISPSD.2011.5890835
[5]  
Hilt O, 2010, PROC INT SYMP POWER, P347
[6]   Gate Recessed Quasi-Normally OFF Al2O3/AlGaN/GaN MIS-HEMT With Low Threshold Voltage Hysteresis Using PEALD AlN Interfacial Passivation Layer [J].
Hsieh, Ting-En ;
Chang, Edward Yi ;
Song, Yi-Zuo ;
Lin, Yueh-Chin ;
Wang, Huan-Chung ;
Liu, Shin-Chien ;
Salahuddin, Sayeef ;
Hu, Chenming Calvin .
IEEE ELECTRON DEVICE LETTERS, 2014, 35 (07) :732-734
[7]   Source-Connected p-GaN Gate HEMTs for Increased Threshold Voltage [J].
Hwang, Injun ;
Oh, Jaejoon ;
Choi, Hyuk Soon ;
Kim, Jongseob ;
Choi, Hyoji ;
Kim, Joonyong ;
Chong, Soogine ;
Shin, Jaikwang ;
Chung, U-In .
IEEE ELECTRON DEVICE LETTERS, 2013, 34 (05) :605-607
[8]   p-GaN Gate HEMTs With Tungsten Gate Metal for High Threshold Voltage and Low Gate Current [J].
Hwang, Injun ;
Kim, Jongseob ;
Choi, Hyuk Soon ;
Choi, Hyoji ;
Lee, Jaewon ;
Kim, Kyung Yeon ;
Park, Jong-Bong ;
Lee, Jae Cheol ;
Ha, Jongbong ;
Oh, Jaejoon ;
Shin, Jaikwang ;
Chung, U-In .
IEEE ELECTRON DEVICE LETTERS, 2013, 34 (02) :202-204
[9]  
Hwang I, 2012, PROC INT SYMP POWER, P41, DOI 10.1109/ISPSD.2012.6229018
[10]   GaN Power Transistors on Si Substrates for Switching Applications [J].
Ikeda, Nariaki ;
Niiyama, Yuki ;
Kambayashi, Hiroshi ;
Sato, Yoshihiro ;
Nomura, Takehiko ;
Kato, Sadahiro ;
Yoshida, Seikoh .
PROCEEDINGS OF THE IEEE, 2010, 98 (07) :1151-1161