In-operando hard X-ray photoelectron spectroscopy study on the impact of current compliance and switching cycles on oxygen and carbon defects in resistive switching Ti/HfO2/TiN cells

被引：52

作者：

Sowinska, Malgorzata ^{[1
]}

Bertaud, Thomas ^{[1
]}

Walczyk, Damian ^{[1
]}

Thiess, Sebastian ^{[2
]}

Calka, Pauline ^{[1
]}

Alff, Lambert ^{[3
]}

Walczyk, Christian ^{[1
]}

Schroeder, Thomas ^{[1
,4
]}

机构：

[1] IHP, D-15236 Frankfurt, Oder, Germany

[2] Deutsch Elektronen Synchrotron DESY, D-22607 Hamburg, Germany

[3] Tech Univ Darmstadt, Inst Mat Sci, D-64287 Darmstadt, Germany

[4] Brandenburg Tech Univ Cottbus, D-03046 Cottbus, Germany

来源：

JOURNAL OF APPLIED PHYSICS | 2014年 / 115卷 / 20期

关键词：

DRIVEN ION MIGRATION;

D O I：

10.1063/1.4879678

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

In this study, direct experimental materials science evidence of the important theoretical prediction for resistive random access memory (RRAM) technologies that a critical amount of oxygen vacancies is needed to establish stable resistive switching in metal-oxide-metal samples is presented. In detail, a novel in-operando hard X-ray photoelectron spectroscopy technique is applied to non-destructively investigates the influence of the current compliance and direct current voltage sweep cycles on the Ti/HfO2 interface chemistry and physics of resistive switching Ti/HfO2/TiN cells. These studies indeed confirm that current compliance is a critical parameter to control the amount of oxygen vacancies in the conducting filaments in the oxide layer during the RRAM cell operation to achieve stable switching. Furthermore, clear carbon segregation towards the Ti/HfO2 interface under electrical stress is visible. Since carbon impurities impact the oxygen vacancy defect population under resistive switching, this dynamic carbon segregation to the Ti/HfO2 interface is suspected to negatively influence RRAM device endurance. Therefore, these results indicate that the RRAM materials engineering needs to include all impurities in the dielectric layer in order to achieve reliable device performance. (C) 2014 AIP Publishing LLC.

引用

页数：6

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