Electroless deposition and evaluation of Cu/multiwalled carbon nanotube composite films on acrylonitrile butadiene styrene resin

被引：12

作者：

Arai, Susumu ^{[1
,2
]}

Kanazawa, Taishi ^{[1
]}

机构：

[1] Shinshu Univ, Fac Engn, Dept Chem & Mat Engn, Nagano 3808553, Japan

[2] Shinshu Univ, Inst Carbon Sci & Technol, Nagano 3808553, Japan

来源：

SURFACE & COATINGS TECHNOLOGY | 2014年 / 254卷

基金：

日本学术振兴会;

关键词：

Multiwalled carbon nanotube; Copper composite; Acrylonitrile butadiene styrene (ABS) resin; Electroless deposition; Adhesion strength; Frictional properties; CHEMICAL-VAPOR-DEPOSITION; REINFORCED COPPER; ELECTRICAL-CONDUCTIVITY; TRIBOLOGICAL BEHAVIOR; THERMAL-CONDUCTIVITY; ELECTRODEPOSITION; RESISTIVITY; FRICTION; ENHANCEMENT; MECHANISM;

D O I：

10.1016/j.surfcoat.2014.06.017

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Cu/multiwalled carbon nanotube (MWCNT) composite films were fabricated by electroless deposition on acrylonitrite butadiene styrene (ABS) resin substrates. Four types of MWCNTs with different dimensions were added to the electroless copper plating baths together with the dispersants sodium lauryl sulfate and hydroxypropyl cellulose. The ABS resin substrates were first subjected to a roughening treatment to improve film adhesion. The microstructure of the composite films was characterized, and it was found that the MWCNTs were uniformly dispersed. The adhesion strength for the films was as high as that for electroless copper films. The composite films had an electrical resistivity in the range of 2.39-2.72 mu Omega cm, and their coefficient of friction was considerably lower than that for electroless copper films. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：224 / 229

页数：6

共 45 条

[1] Fabrication, characterization and mechanical properties of hybrid composites of copper using the nanoparticulates of SiC and carbon nanotubes [J].

Akbarpour, M. R. ;

Salahi, E. ;

Hesari, F. Alikhani ;

Simchi, A. ;

Kim, H. S. .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 572 :83-90

[2] Various carbon nanofiber-copper composite films prepared by electrodeposition [J].

Arai, S ;

Endo, M .

ELECTROCHEMISTRY COMMUNICATIONS, 2005, 7 (01) :19-22

[3] Carbon nanofiber-copper composites fabricated by electroplating [J].

Arai, S ;

Endo, M .

ELECTROCHEMICAL AND SOLID STATE LETTERS, 2004, 7 (03) :C25-C26

[4] Electroless Deposition of Cu/Multiwalled Carbon Nanotube Composite Films with Improved Frictional Properties [J].

Arai, Susumu ;

Kanazawa, Taishi .

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2014, 3 (06) :P201-P206

[5] Mechanism for Codeposition of Multiwalled Carbon Nanotubes with Copper from Acid Copper Sulfate Bath [J].

Arai, Susumu ;

Kato, Akihiro .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2013, 160 (09) :D380-D385

[6] Fabrication of various electroless Ni-P alloy/multiwalled carbon nanotube composite films on an acrylonitrile butadiene styrene resin [J].

Arai, Susumu ;

Sato, Toshihiko ;

Endo, Morinobu .

SURFACE & COATINGS TECHNOLOGY, 2011, 205 (10) :3175-3181

[7] Effects of Additives on Cu-MWCNT Composite Plating Films [J].

Arai, Susumu ;

Saito, Takashi ;

Endo, Morinobu .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 157 (03) :D127-D134

[8] Cu-MWCNT Composite Films Fabricated by Electrodeposition [J].

Arai, Susumu ;

Saito, Takashi ;

Endo, Morinobu .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 157 (03) :D147-D153

[9] Enhancement of Electrical Conductivity of Copper/Carbon-Nanotube Composite Wire [J].

Banno, Nobuya ;

Takeuchi, Takao .

JOURNAL OF THE JAPAN INSTITUTE OF METALS, 2009, 73 (09) :651-658

[10] Electric resistivity of multi-walled carbon nanotubes at high temperatures [J].

Barberio, M. ;

Camarca, M. ;

Barone, P. ;

Bonanno, A. ;

Oliva, A. ;

Xu, F. .

SURFACE SCIENCE, 2007, 601 (13) :2814-2818

← 1 2 3 4 5 →