Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing

被引：57

作者：

Huang, T. C. ^{[1
]}

Yang, T. L. ^{[1
]}

Ke, J. H. ^{[1
]}

Hsueh, C. H. ^{[1
]}

Kao, C. R. ^{[1
]}

机构：

[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 10764, Taiwan

来源：

SCRIPTA MATERIALIA | 2014年 / 80卷

关键词：

Intermetallic compound; Current stressing; Sn grain orientation; Serrated dissolution; DIFFUSION; TIN; ELECTROMIGRATION;

D O I：

10.1016/j.scriptamat.2014.02.010

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Electron current stressing of Ni/Sn3Ag/Ni solder joints was conducted in a straight-line configuration to avoid the complication of current crowding. It was confirmed that Sn grain orientation dominated the dissolution of the Ni substrate and the precipitation of intermetallic inside Sn3Ag. Current crowding played no role here. Additionally, it was found that the direction of serrated cathode dissolution exhibited a strong correlation with Sn grain orientation. These effects were explained in terms of the extreme anisotropy of Ni diffusion in Sn. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：37 / 40

页数：4

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