Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 μm Sn-Ag-Cu solder bumps

被引：17
|
作者：
Huang, M. L. [1 ]
Yang, F. [1 ]
Zhao, N. [1 ]
Yang, Y. C. [1 ]
机构：
[1] Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2014年 / 602卷
基金：
中国国家自然科学基金;
关键词：
Intermetallics; Crystal growth; Synchrotron radiation; Ag3Sn; Undercooling; Precipitation; LEAD-FREE SOLDER; CREEP RESISTANCE; THERMAL-BEHAVIOR; MICROSTRUCTURE; ALLOYS; ELECTROMIGRATION; INTERFACE; ADDITIONS; CU6SN5; JOINTS;
D O I：
10.1016/j.jallcom.2014.03.047
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Synchrotron radiation real-time imaging technology was used to in situ study the dissolution and precipitation behavior of Ag3Sn plates in sub-50 mu m Sn-4.0Ag-0.5Cu flip chip solder bumps on Ni-P under bump metallization (UBM). The dissolution rate of large Ag3Sn plates was as slow as 0.1-0.2 mu m/s at the heating stage, while the precipitation rate exceeded 5 mu m/s at the cooling stage with an undercooling of 31-55 degrees C. The random precipitation behavior of Ag3Sn plates was in situ observed and explained from the perspective of cluster. This study shows an effective method to investigate the microstructural evolution and the undercooling of phases in real ultra-fine solder joints. (C) 2014 Elsevier B. V. All rights reserved.
引用
收藏
页码：281 / 284
页数：4
相关论文
共 20 条
  • [1] Dissolution and Precipitation of Ag3Sn Plates in Ultra Fine Solder Joints Using Synchrotron Radiation Real-time Imaging Technology
    Huang, Mingliang
    Yang, Fan
    Zhao, Ning
    Zhang, Fei
    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 822 - 825
  • [2] Formation of Ag3Sn plates in SnAgCu solder bumps
    Gong, Jicheng
    Liu, Changqing
    Conway, Paul P.
    Silberschmidt, Vadim V.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2010, 527 (10-11): : 2588 - 2591
  • [3] Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys
    Cui, Y.
    Xian, J. W.
    Zois, A.
    Marquardt, K.
    Yasuda, H.
    Gourlay, C. M.
    ACTA MATERIALIA, 2023, 249
  • [4] MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER
    Wang Xiaojing
    Zhu Qingsheng
    Wang Zhongguang
    Shang Jianku
    ACTA METALLURGICA SINICA, 2009, 45 (08) : 912 - 918
  • [5] Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn-Ag-Cu Solder Balls
    Mueller, Maik
    Panchenko, Iuliana
    Wiese, Steffen
    Wolter, Klaus-Juergen
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (01): : 18 - 29
  • [6] The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder
    Huann-Wu Chiang
    Kenndy Chang
    Jun-Yuan Chen
    Journal of Electronic Materials, 2006, 35 : 2074 - 2080
  • [7] The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder
    Chiang, Huann-Wu
    Chang, Kenndy
    Chen, Jun-Yuan
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (12) : 2074 - 2080
  • [8] In-situ study on growth behavior of Ag3Sn in Sn-3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology
    Ma, H. T.
    Qu, L.
    Huang, M. L.
    Gu, L. Y.
    Zhao, N.
    Wang, L.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2012, 537 : 286 - 290
  • [9] Thermomigration-induced asymmetrical precipitation of Ag3Sn plates in micro-scale Cu/Sn-3.5Ag/Cu interconnects
    Huang, M. L.
    Yang, F.
    Zhao, N.
    MATERIALS & DESIGN, 2016, 89 : 116 - 120
  • [10] Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1 wt.% Zn addition
    Luo, Z. -B.
    Zhao, J.
    Gao, Y. -J.
    Wang, L.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 500 (01) : 39 - 45
12