Gate-Bias Induced Threshold Voltage ( $V_{TH}$ ) Instability in P-N Junction/AlGaN/GaN HEMT

被引:14
作者
Jiang, Zuoheng [1 ]
Li, Lingling [1 ]
Wang, Chengcai [1 ]
Zhao, Junlei [1 ]
Hua, Mengyuan [1 ]
机构
[1] Southern Univ Sci & Technol, Dept Elect & Elect Engn, Shenzhen 518055, Peoples R China
基金
中国国家自然科学基金;
关键词
Logic gates; Stress; Temperature measurement; HEMTs; Delays; Pulse measurements; Thermal stability; Hole trapping; positive bias temperature instability (PBTI); p-GaN gate; p-n junction (PNJ)-high electron-mobility transistor (HEMT); threshold voltage instability; V-TH; GAN LAYER; TRANSPORT; SHIFT;
D O I
10.1109/TED.2022.3177397
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, we studied the threshold voltage ( $V_{TH}$ ) instability in E-mode p-n junction (PNJ)/AlGaN/GaN high-electron-mobility transistor (HEMT) using pulsed-I/V measurement and positive bias temperature instability (PBTI) test. $V_{TH}$ shifts positively under forward gate bias, which is ascribed to electron trapping in the gate-stack region. Benefiting from the special p-GaN/n-GaN junction, reduced electric field suppresses electron trapping in the PNJ gate, resulting in more stable $V_{TH}$ compared with the conventional Schottky-type p-GaN gate. Specifically, less positive threshold voltage shift ( $V_{TH}$ ) is observed under higher temperatures, or after being stressed for a prolonged period with gate bias exceeding 6 V. The decrease in positive $V_{TH}$ results from enhanced hole injection and especially hole trapping in the p-GaN/n-GaN interdiffusion region, which compensates for electron trapping and reduces positive $V_{TH}$ .
引用
收藏
页码:3654 / 3659
页数:6
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