A study of nano particles in SnAg-Based lead free solders for intermetallic compounds and drop test performance

被引：26

作者：

Amagai, Masazumi ^{[1
]}

机构：

[1] Texas Instruments Japan, Tsukuba Technol Ctr, Modeling & Characterizat, Tsukuba, Ibaraki 3050841, Japan

来源：

56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS | 2006年

关键词：

D O I：

10.1109/ECTC.2006.1645802

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Co, Ni, Pt, Al, P, Cu, Zn, Ge, Ag, In, Sb or Au including in Sn-Ag based lead free solders were evaluated to study if these nano particles can reduce the growth of intermetallic compounds after 4 time reflow processes and thermal aging. Also, these nano particles were studied if they can reduce the frequency of occurrence of intermetallic compound fractures in high impact pull tests. In addition to intermetallic compound analyses, these nano particle effects on solder ball hardness were studied if nano particles affects solder hardness and displacement in drop tests. Finally, these nano particle effects on drop test performance were studied. This study found that Co, Ni and Pt were very effective for the growth of intermetallic compounds and drop test performance compared to Cu, Ag, Au, Zn, Al, In, P, Ge and Sb.

引用

页码：1170 / 1190

页数：21