A general solution for the two-dimensional stress analysis of balanced and unbalanced adhesively bonded joints

被引：46
作者：
Liu, Zunxu [1 ]
Huang, YongAn [1 ]
Yin, Zhouping [1 ]
Bennati, Stefano [2 ]
Valvo, Paolo S. [2 ]
机构：
[1] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Peoples R China
[2] Univ Pisa, Dept Civil & Ind Engn, I-56126 Pisa, Italy
来源：
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES | 2014年 / 54卷
基金：
中国国家自然科学基金;
关键词：
Stress analysis; Analytical solution; Adhesively bonded joints; Stiffened plate/joint; Single-strap joint; Single-lap joint; BEAM-THEORY MODEL; ELASTIC ANALYSIS; LAP JOINTS;
D O I：
10.1016/j.ijadhadh.2014.05.011
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
This paper presents an efficient analytical solution strategy to determine the adhesive stresses in balanced and unbalanced adhesively bonded joints with mixed force loading and/or displacement boundary conditions. The adhesive stresses are expressed in terms of geometrical dimensions and material properties, combined with integration constants obtained numerically. The model is successfully applied for the analysis of various types of joints, including balanced and unbalanced stiffened plate/joint, single-strap joint, and single-lap joint. In all such cases, the linear equation sets are supplied to determine the integration constants in the final stress expressions. The analytical predictions agree well with the finite element results for adhesive stresses. This proposed model can be extended conveniently to predict the mechanical behavior of similar bonded structures such as composite laminates, electronics packaging, and flexible electronics structures. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码：112 / 123
页数：12
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