共 50 条
Thermal-electrical analogy for simulations of superconducting fault current limiters
被引:53
|作者:
de Sousa, W. T. B.
[1
,2
]
Polasek, A.
[3
]
Dias, R.
[3
]
Matt, C. F. T.
[3
]
de Andrade, R., Jr.
[2
]
机构:
[1] Karlsruhe Inst Technol, Inst Tech Phys, D-76344 Eggenstein Leopoldshafen, Germany
[2] Univ Fed Rio de Janeiro, LASUP Lab Appl Superconduct, BR-21945970 Rio De Janeiro, Brazil
[3] CEPEL Elect Power Res Ctr, ELETROBRAS Syst, BR-21941911 Rio De Janeiro, Brazil
来源:
关键词:
Superconducting fault current limiters;
Thermal-electrical analogy;
Simulations;
TEMPERATURE;
MODEL;
ELEMENT;
FIELD;
D O I:
10.1016/j.cryogenics.2014.04.015
中图分类号:
O414.1 [热力学];
学科分类号:
摘要:
In spite of the recent advances achieved with superconducting fault current limiters (SCFCL's), modeling and simulation of such devices are still important issues. There are different approaches for modeling SCFCL's, whereas computational simulations provide a better understanding of the behavior of SCFCL devices. In addition, results of hard experimental access may be achieved by means of computational simulation. The aim of this paper is to present a simple computational model to predict both the electrical and thermal behaviors of SCFCL devices. The main contribution of the present work is the use of a thermal-electrical analogy to solve the heat transfer equations inside SCFCL sub-components, which enables one to handle with relative easy the strong and nonlinear coupling between thermal and electrical phenomena. The limitation and quenching behavior of a resistive SCFCL assembly was investigated for overcurrents up to 67 kA(rms), (V-o = 1 kV(rms)). Simulation results were compared to overcurrent experimental tests. A good agreement between simulations and tests has been found in the present work. Moreover, the results of the developed model were also compared with finite element results reported in the literature. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:97 / 109
页数:13
相关论文