Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow

被引：14

作者：

Aziz, M. S. Abdul ^{[1
]}

Abdullah, M. Z. ^{[1
]}

Khor, C. Y. ^{[1
]}

Jalar, A. ^{[2
]}

Ani, F. Che ^{[3
]}

Yan, Nobe ^{[4
]}

Cheok, C. ^{[5
]}

机构：

[1] Univ Sains Malaysia, Sch Mech Engn, Nibong Tebal 14300, Penang, Malaysia

[2] Univ Kebangsaan Malaysia, Inst Microengn & Nanoelect, Bangi 43600, Selangor, Malaysia

[3] Celestica Sdn M Bhd, Kulim, Kedah, Malaysia

[4] Shenzhen Kunqi Xinhua Technol Co Ltd, Shenzhen, Guangdong, Peoples R China

[5] Cyntac Pte Ltd, Singapore, Singapore

来源：

NUMERICAL HEAT TRANSFER PART A-APPLICATIONS | 2016年 / 69卷 / 03期

关键词：

OFFSET;

D O I：

10.1080/10407782.2015.1069675

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This study aims to investigate the influence of a conveyor angle on capillary flow during the wave soldering process. Finite volume-based simulation is utilized to study the capillary flow of molten solder. Molten solder filling through capillary action of a pin-through-hole (PTH) is considered at different conveyor angles (i.e., 0-10 degrees). Two PTH positions, namely, center (r/R=0.2) and offset (r/R=0.6), are investigated. The effects of a conveyor angle on molten solder filling volume, time, pressure profile, and velocity vector are numerically analyzed.

引用

页码：295 / 310

页数：16

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