Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow

被引：13
作者：
Aziz, M. S. Abdul [1 ]
Abdullah, M. Z. [1 ]
Khor, C. Y. [1 ]
Jalar, A. [2 ]
Ani, F. Che [3 ]
Yan, Nobe [4 ]
Cheok, C. [5 ]
机构：
[1] Univ Sains Malaysia, Sch Mech Engn, Nibong Tebal 14300, Penang, Malaysia
[2] Univ Kebangsaan Malaysia, Inst Microengn & Nanoelect, Bangi 43600, Selangor, Malaysia
[3] Celestica Sdn M Bhd, Kulim, Kedah, Malaysia
[4] Shenzhen Kunqi Xinhua Technol Co Ltd, Shenzhen, Guangdong, Peoples R China
[5] Cyntac Pte Ltd, Singapore, Singapore
来源：
NUMERICAL HEAT TRANSFER PART A-APPLICATIONS | 2016年 / 69卷 / 03期
关键词：
OFFSET;
D O I：
10.1080/10407782.2015.1069675
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
This study aims to investigate the influence of a conveyor angle on capillary flow during the wave soldering process. Finite volume-based simulation is utilized to study the capillary flow of molten solder. Molten solder filling through capillary action of a pin-through-hole (PTH) is considered at different conveyor angles (i.e., 0-10 degrees). Two PTH positions, namely, center (r/R=0.2) and offset (r/R=0.6), are investigated. The effects of a conveyor angle on molten solder filling volume, time, pressure profile, and velocity vector are numerically analyzed.
引用
收藏
页码：295 / 310
页数：16
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