Condition monitoring of power module using S-parameters, TDR, and TDT

被引:4
作者
Pascal, Y. [1 ]
Daschner, F. [2 ]
Liserre, M. [3 ]
Hoeft, M. [2 ]
机构
[1] Fraunhofer Inst Silicon Technol ISIT, Fraunhoferstr 1, D-25524 Itzehoe, Germany
[2] Univ Kiel, Chair Microwave Engn, Kiel, Germany
[3] Univ Kiel, Chair Power Elect, Kiel, Germany
关键词
Condition monitoring; Power module; Power electronics; S; -parameters; TDR; TDT; Time domain reflectometry; Time domain transmission; Reflectometry; Packaging;
D O I
10.1016/j.microrel.2022.114615
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Condition monitoring of power electronics is gaining interest as power electronics expends to mission-critical applications. This paper offers a preliminary experimental study of the viability of using S-parameters and time-domain reflectometry measurements to monitor the degradation of a power module. To this end, mea-surements were performed on a standard high current power module which was artificially aged by cutting wire bonds one by one. The study demonstrates a clear trend in the evolution of measured parameters, and thereby the possibility to monitor the power module degradation under the specific test conditions. This opens a new con-dition monitoring technology for power electronics systems.
引用
收藏
页数:6
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