Condition monitoring of power module using S-parameters, TDR, and TDT

被引：3

作者：

Pascal, Y. ^{[1
]}

Daschner, F. ^{[2
]}

Liserre, M. ^{[3
]}

Hoeft, M. ^{[2
]}

机构：

[1] Fraunhofer Inst Silicon Technol ISIT, Fraunhoferstr 1, D-25524 Itzehoe, Germany

[2] Univ Kiel, Chair Microwave Engn, Kiel, Germany

[3] Univ Kiel, Chair Power Elect, Kiel, Germany

来源：

MICROELECTRONICS RELIABILITY | 2022年 / 138卷

关键词：

Condition monitoring; Power module; Power electronics; S; -parameters; TDR; TDT; Time domain reflectometry; Time domain transmission; Reflectometry; Packaging;

D O I：

10.1016/j.microrel.2022.114615

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Condition monitoring of power electronics is gaining interest as power electronics expends to mission-critical applications. This paper offers a preliminary experimental study of the viability of using S-parameters and time-domain reflectometry measurements to monitor the degradation of a power module. To this end, mea-surements were performed on a standard high current power module which was artificially aged by cutting wire bonds one by one. The study demonstrates a clear trend in the evolution of measured parameters, and thereby the possibility to monitor the power module degradation under the specific test conditions. This opens a new con-dition monitoring technology for power electronics systems.

引用

页数：6

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