Topographic dependence of plasma charging induced device damage

被引:0
作者
Vahedi, V
Benjamin, N
Perry, A
机构
来源
1997 2ND INTERNATIONAL SYMPOSIUM ON PLASMA PROCESS-INDUCED DAMAGE | 1997年
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We examine a particular mechanism for surface charging during plasma processing, namely charged particle flux shadowing caused by surface topography. We derive an analytic model for the voltage drop across the gate oxide as a function of electron and ion shadowing and compare this mechanism's potential for inducing device damage to that caused by plasma density non-uniformity. The charge dose magnitude that can result from the shadowing mechanism is shown to be consistent with that required for damage to devices.
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页码:41 / 44
页数:4
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