Structure and thermal behavior of lead-free solders prepared by rapid solidification of their melt

Purpose - The paper aims to investigate the structure and thermal stability of newly developed lead-free Sn-based alloys which can be used as novel materials in the soldering of electronic components. Design/methodology/approach - Rapid solidification was used to prepare the alloys. Findings - The results showed that the microstructure of these solders exhibited uniform distribution and small-sized intermetallic compounds. Also, smaller crystalline size can be expected compared to commercially available counterparts. The analyses revealed a uniform and homogenous distribution of the small intermetallic particles of Cu6Sn5 and Ag4Sn in the microstructure of solders. The practical implications mean an improvement in mechanical properties and thermal stability of such solder joints, which is a precondition of low mechanical, thermo-mechanical stresses in their structure. Originality/value - The originality lies in the production of these alloys by the melt spinning technique which was not previously used in the electronics industry.