Silica-assisted fixed agglomerated diamond abrasive polishing

被引：30

作者：

Chen, Jiapeng ^{[1
,2
]}

Zhu, Yongwei ^{[1
]}

Peng, Yanan ^{[1
]}

Guo, Jitong ^{[1
]}

Ding, Cong ^{[1
]}

机构：

[1] Nanjing Univ Aeronaut & Astronaut, Coll Mech & Elect Engn, Nanjing 210016, Peoples R China

[2] Henan Inst Sci & Technol, Sch Mech & Elect Engn, Xinxiang 453003, Henan, Peoples R China

来源：

JOURNAL OF MANUFACTURING PROCESSES | 2020年 / 59卷

基金：

中国国家自然科学基金;

关键词：

Silica-Assisted fixed agglomerated diamond abrasive polishing (SA-FADAP); Agglomerated diamond abrasive; Silica grain; Micro-Fracture; Self-Conditioning; MATERIAL REMOVAL; SAPPHIRE; PAD; MECHANISM; TOPOGRAPHY; GRITS; SIO2;

D O I：

10.1016/j.jmapro.2020.09.013

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The fixed agglomerated diamond abrasive pad had been used to planarize ultra-hard and brittle materials such as sapphire and SiC. However, the processing stability and surface integrity of sapphire remain to be improved. A silica-assisted fixed agglomerated diamond abrasive polishing (SA-FADAP) process was developed to solve the above mentioned problems. The material removal mechanism of the SA-FADAP was explored by analyzing material removal rate gradient (MRRG), surface topography of workpieces, the pad abrasion, and wear debris in the slurry wastes. The effects of silica grains on the self-conditioning processes of fixed agglomerated diamond abrasive pads were discussed. The efficient and stable SA-FADAP was mainly realized by the chemical-mechanical interaction produced by agglomerated diamond abrasives and silica polishing slurry.

引用

页码：595 / 603

页数：9

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