Correlation of Microstructural Properties with Thermoelectric Performance of Bi0.5Sb1.5Te3 Films Fabricated by Electroplating

被引：1

作者：

Koukharenko, E. ^{[1
]}

Li, X. ^{[2
]}

Kuleshova, J. ^{[3
]}

Fowler, M. ^{[4
]}

Frety, N. ^{[5
]}

Tudor, M. J. ^{[1
]}

Beeby, S. P. ^{[1
]}

Nandhakumar, I ^{[3
]}

White, N. M. ^{[1
]}

机构：

[1] Univ Southampton, Sch Elect & Comp Sci, Southampton SO17 1BJ, Hants, England

[2] Univ Southampton, Sch Engn Sci, Southampton SO17 1BJ, Hants, England

[3] Univ Southampton, Sch Chem, Southampton SO17 1BJ, Hants, England

[4] Univ Southampton, Sch Phys & Astron, Southampton SO17 1BJ, Hants, England

[5] Univ Montpellier 2, Equipe PMOF, Inst Charles Gerhardt, F-34095 Montpellier 5, France

来源：

THERMOELECTRIC MATERIALS 2010 - GROWTH, PROPERTIES, NOVEL CHARACTERIZATION METHODS AND APPLICATIONS | 2010年 / 1267卷

基金：

英国工程与自然科学研究理事会;

关键词：

THIN-FILMS; BISMUTH; BI2TE3;

D O I：

10.1557/PROC-1267-DD10-18

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This study shows for the first time, the correlation between the microstructural properties (chemical composition and its homogeneity) and the thermoelectric properties for p-type Bi0.5Sb1.5Te3 electroplated films (10-15 mu m thickness). High microstructural quality of Bi0.5Sb1.5Te3 electroplated films (a close to stoichiometry chemical composition with its high homogeneity elements distribution) was achieved by using an additive in the plating solution (sodium ligninsulfonate) as a surfactant agent. A fine-grained microstructure of 280 nm to 1 mu m has been observed for these materials, which half that of the plated films without a surfactant. The thermoelectric properties of electrodeposited Bi0.5Sb1.5Te3 films obtained without microstructural optimisation, show modest Seebeck coefficient values of 20-120 mu V/K, electrodeposited film with an optimised microstructure exhibits very high values of Seebeck coefficient of 220-300 mu V/K.

引用

页数：7

共 10 条

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