Monolithic 3D stacked multiply-accumulate units

被引:4
作者
Lee, Young Seo [1 ]
Kim, Kyung Min [5 ]
Lee, Ji Heon [2 ]
Gong, Young-Ho [4 ]
Kim, Seon Wook [3 ]
Chung, Sung Woo [1 ]
机构
[1] Korea Univ, Dept Comp Sci, Seoul 02841, South Korea
[2] Korea Univ, Dept Semicond Syst Engn, Seoul 02841, South Korea
[3] Korea Univ, Sch Elect Engn, Seoul 02841, South Korea
[4] Kwangwoon Univ, Dept Comp Engn, Seoul 01897, South Korea
[5] SK Hynix, Icheon 17336, South Korea
基金
新加坡国家研究基金会;
关键词
Multiply-accumulate; M3D stacking; TSV-Based 3D stacking; ASIC;
D O I
10.1016/j.vlsi.2020.10.006
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The monolithic 3D stacking (M3D) reduces the critical path delay, leveraging 1) short latency of a monolithic inter-tier via (MIV) and 2) short 2D interconnect and cell delay through smaller footprint. In this paper, we propose M3D stacked multiply-accumulate (MAC) units; MAC units have a relatively large number of long wires. With the Samsung 28 nm ASIC library, the M3D stacked MAC units reduce the critical path delay by up to 28.9%, compared to the conventional 2D structure. In addition, the M3D stacked MAC units reduce dynamic energy and leakage power by up to 9.6% and 21.7%, respectively. Compared to the TSV stacked MAC units, the M3D stacked MAC units consume less dynamic energy and leakage power by up to 37.1% and 73.6%, respectively. Though the 3D stacking technology inevitably causes higher peak temperature than the 2D structure, our thermal results show that the peak temperature of the M3D stacking is always lower than that of the TSV-based 3D stacking. Furthermore, when the size of the MAC unit is optimized in convolutional neural network (CNN) applications, the peak temperature of the M3D stacking is 88.3 degrees C at most, which is still under the threshold temperature.
引用
收藏
页码:183 / 189
页数:7
相关论文
共 24 条
  • [1] Abou-Seido A.I., 2002, IEEE INT C COMP DES
  • [2] Advanced Micro Devices (AMD), RAD RX VEGA64
  • [3] Generating log-normal mock catalog of galaxies in redshift space
    Agrawal, Aniket
    Makiya, Ryu
    Chiang, Chi-Ting
    Jeong, Donghui
    Saito, Shun
    Komatsu, Eiichiro
    [J]. JOURNAL OF COSMOLOGY AND ASTROPARTICLE PHYSICS, 2017, (10):
  • [4] [Anonymous], 2013, P 40 ANN INT S COMP
  • [5] [Anonymous], 2016, SAMS BEG MASS PROD W
  • [6] Chang K., 2017, IEEE ACM INT S LOW P
  • [7] Chen K., 2012, CACTI 3DD ARCH LEV M
  • [8] Do CT, 2019, I SYMPOS LOW POWER E
  • [9] Gong Y. -H., IEEE T EMERGING TOPI
  • [10] International Technology Roadmap for Semiconductors (ITRS), ITRS ROADM VERS 2 0