Comprehensive static characterization of vertical electrostatically actuated polysilicon beams

被引:14
作者
Chan, EK [1 ]
Garikipati, K [1 ]
Dutton, RW [1 ]
机构
[1] Stanford Univ, Ctr Integrated Syst, Stanford, CA 94305 USA
来源
IEEE DESIGN & TEST OF COMPUTERS | 1999年 / 16卷 / 04期
关键词
D O I
10.1109/54.808212
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Vertical electrostatically actuated polysilicon beams are characterized through electrical and optical measurements. The extrapolated behavior of a dual-bias-electrode structure serves as a CAD tool benchmark.
引用
收藏
页码:58 / 65
页数:8
相关论文
共 10 条
[1]   Characterization of contact electromechanics through capacitance-voltage measurements and simulations [J].
Chan, EK ;
Garikipati, K ;
Dutton, RW .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1999, 8 (02) :208-217
[2]   POST BUCKLING OF MICROMACHINED BEAMS [J].
FANG, W ;
WICKERT, JA .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1994, 4 (03) :116-122
[3]  
Gupta RK., 1997, THESIS MIT
[4]  
*HIBB KARLSS SOR I, 1996, ABAQUS STAND US MAN
[5]  
KOESTER D, 1996, SMART MUMPS DESIGN H
[6]   DYNAMIC MICROMECHANICS ON SILICON - TECHNIQUES AND DEVICES [J].
PETERSEN, KE .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1978, 25 (10) :1241-1250
[7]  
SHARPE WN, 1998, IEEE SOL STAT SENS A, P17
[8]   MECHANICAL DEFLECTION OF CANTILEVER MICROBEAMS - A NEW TECHNIQUE FOR TESTING THE MECHANICAL-PROPERTIES OF THIN-FILMS [J].
WEIHS, TP ;
HONG, S ;
BRAVMAN, JC ;
NIX, WD .
JOURNAL OF MATERIALS RESEARCH, 1988, 3 (05) :931-942
[9]  
WILSON NM, 1998, P ASME INT MECH ENG, V66, P565
[10]  
1998, P IEEE AUG