Wettability of SiC/liquid Cu with Ti additive system

被引：6

作者：

Li, SJ ^{[1
]}

Zang, XM ^{[1
]}

Duan, HP ^{[1
]}

机构：

[1] Beijing Univ Aeronaut & Astronaut, Dept Mat Sci & Engn, Beijing 100083, Peoples R China

来源：

HIGH-PERFORMANCE CERAMICS 2001, PROCEEDINGS | 2002年 / 224-2卷

关键词：

wettability; contact angle; interface; interfacial reaction;

D O I：

10.4028/www.scientific.net/KEM.224-226.749

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Wettability of ceramics by liquid metals is of importance for joining of ceramics to metals and manufacturing of cermets. Wettability of reaction sintered SiC ceramic/liquid Cu with Ti additive system was studied. The contact angle was determined by high temperature photography. The microstructure and composition of the interfacial region were analyzed. For SiC/Cu system, the contact angle of physical wetting at 1089degreesC in vacuum is 93.5degrees, but the stabilized contact angle of chemical wetting at 1140degreesC is 13.1degrees. The titanium additive remark-ably affects the wettability of the system. Microstructural study reveals that inter-diffusions take place and reaction layers form at the interfaces. TiC, TiSi2, Ti5Si4, CuTi2 and C have been found in the reaction products of SiC/85Cu + 15Ti (wt%) system.

引用

页码：749 / 754

页数：6

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