PIXAPP Photonics Packaging Pilot Line - Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber Connectivity

被引：15

作者：

Bundalo, Ivan-Lazar ^{[1
,2
]}

Morrissey, Padraic E. ^{[1
,2
]}

Annoni, Andrea ^{[3
,4
]}

Baets, Roel ^{[5
]}

Blache, Fabrice ^{[7
]}

Breyne, Laurens ^{[5
]}

Carrol, Lee ^{[1
,8
]}

Collins, Sean ^{[1
]}

Dietrich, Philipp-Immanuel ^{[9
,10
]}

Halmo, Leos ^{[11
]}

Jorge, Filipe ^{[7
]}

Karppinen, Mikko ^{[12
]}

Kaunisto, Mikko ^{[12
]}

Kelly, Brian ^{[13
]}

Van Kerrebrouck, Joris ^{[5
]}

Koos, Christian ^{[14
]}

Lahti, Markku ^{[12
]}

Lambrecht, Joris ^{[5
]}

Marcello, Tienforti ^{[3
,15
]}

Lee, Junsu Su ^{[1
]}

Missinne, Jeroen ^{[5
]}

Ossieur, Peter ^{[5
]}

Pessina, Roberto ^{[3
]}

Sterken, Tom ^{[5
,16
]}

Van Steenberge, Geert ^{[5
]}

Vannucci, Antonello ^{[3
,17
]}

Vannucchi, Alessandro ^{[3
]}

Verplancke, Rik ^{[5
]}

Wuytens, Pieter ^{[5
,6
]}

Xu, Yilin ^{[14
]}

Zoldak, Martin ^{[11
]}

OaBrien, Peter ^{[1
]}

机构：

[1] Tyndall Natl Inst, Photon Packaging & Integrat Grp, Cork T12 R5CP, Ireland

[2] CSEM SE, CH-6055 Alpnach, Switzerland

[3] Cordon Elect Italy, I-20864 Agrate Brianza, Italy

[4] STMicroelectronics Srl, I-20864 Agrate Brianza, Italy

[5] Univ Ghent, IMEC, B-9052 Ghent, Belgium

[6] Ligentec SA, Chem Dent dOche 1B, CH-1024 Ecublens, Switzerland

[7] III V Labs, Campus Polytech,1 Ave Augustin Fresnel, F-91767 Palaiseau, France

[8] Sustainable Energy Author Ireland, St Kevins, Dublin 2, Ireland

[9] KIT, D-76131 Karlsruhe, Germany

[10] Vanguard Photon GmbH, D-76185 Karlsruhe, Germany

[11] Argotech AS, Nachod 54701, Czech Republic

[12] VTT, Oulu 90570, Finland

[13] Eblana Photon, West Pier Business Campus, Dublin A96 A621, Ireland

[14] Karlsruhe Inst Technol KIT, Inst Photon & Quantum Elect, D-76131 Karlsruhe, Germany

[15] Metallux SA, CH-6850 Mendrisio, Switzerland

[16] VLAIO, B-1030 Brussels, Belgium

[17] Evoelectronics Srl, I-00040 Pomezia, Italy

来源：

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS | 2022年 / 28卷 / 03期

关键词：

Packaging; Photonics; Integrated optics; Optical device fabrication; High-speed optical techniques; Optical fibers; Optical transmitters; Electrooptic modulators; chip scale packaging; demodulation; electronic packaging thermal management; electronics packaging; high-speed electronics; high-speed integrated circuits; intensity modulation; modulation; PIC; PIC packaging; photonics; semiconductor device packaging; silicon photonics; telecommunications; communication systems; TECHNOLOGY;

D O I：

10.1109/JSTQE.2022.3158891

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPP's open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, together with flipchip control electronics, hybrid laser and micro-optics. The transceiver used the on-chip micro-optics to enable a pluggable fiber connection, avoiding the need to bond optical fibers directly to the photonic chip. Finally, the packaged transceiver module was tested, showing 56 Gb/s loop-back modulation and de-modulation, validating both the transmitter and receiver performance.

引用

页数：11

共 19 条

[1]

[Anonymous], 2021, EUROPRACTICE SI PHOT

[2] Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices [J].

Carroll, Lee ;

Lee, Jun-Su ;

Scarcella, Carmelo ;

Gradkowski, Kamil ;

Duperron, Matthieu ;

Lu, Huihui ;

Zhao, Yan ;

Eason, Cormac ;

Morrissey, Padraic ;

Rensing, Marc ;

Collins, Sean ;

Hwang, How Yuan ;

O'Brien, Peter .

APPLIED SCIENCES-BASEL, 2016, 6 (12)

[3] In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration [J].

Dietrich, P. -I. ;

Blaicher, M. ;

Reuter, I. ;

Billah, M. ;

Hoose, T. ;

Hofmann, A. ;

Caer, C. ;

Dangel, R. ;

Offrein, B. ;

Troppenz, U. ;

Moehrle, M. ;

Freude, W. ;

Koos, C. .

NATURE PHOTONICS, 2018, 12 (04) :241-+

[4] Silicon photonic devices and integrated circuits [J].

Dong, Po ;

Chen, Young-Kai ;

Duan, Guang-Hua ;

Neilson, David T. .

NANOPHOTONICS, 2014, 3 (4-5) :215-228

[5] Hybrid Integration of Laser Source on Silicon Photonic Integrated Circuit for low-cost Interferometry Medical Device [J].

Duperron, Matthieu ;

Carroll, Lee ;

Rensing, Marc ;

Collins, Sean ;

Zhao, Yan ;

Li, Yanlu ;

Baets, Roel ;

O'Brien, Peter .

OPTICAL INTERCONNECTS XVII, 2017, 10109

[6] Heterogeneous Silicon Photonic Integrated Circuits [J].

Komljenovic, Tin ;

Davenport, Michael ;

Hulme, Jared ;

Liu, Alan Y. ;

Santis, Christos T. ;

Spott, Alexander ;

Srinivasan, Sudharsanan ;

Stanton, Eric J. ;

Zhang, Chong ;

Bowers, John E. .

JOURNAL OF LIGHTWAVE TECHNOLOGY, 2016, 34 (01) :20-35

[7] Review of LTCC Technology for Millimeter Waves and Photonics [J].

Lahti, Markku ;

Kautio, Kari ;

Karppinen, Mikko ;

Keranen, Kimmo ;

Ollila, Jyrki ;

Karioja, Pentti .

INTERNATIONAL JOURNAL OF ELECTRONICS AND TELECOMMUNICATIONS, 2020, 66 (02) :361-+

[8] Meeting the Electrical, Optical, and Thermal Design Challenges of Photonic-Packaging [J].

Lee, Jun Su ;

Carroll, Lee ;

Scarcella, Carmelo ;

Pavarelli, Nicola ;

Menezo, Sylvie ;

Bernabe, Stephane ;

Temporiti, Enrico ;

O'Brien, Peter .

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2016, 22 (06) :409-417

[9] Silicon photonics packaging with lateral fiber coupling to apodized grating coupler embedded circuit [J].

Li, Chao ;

Chee, Koh Sing ;

Tao, Jifang ;

Zhang, Huijuan ;

Yu, Mingbin ;

Lo, G. Q. .

OPTICS EXPRESS, 2014, 22 (20) :24235-24240

[10]

Liu X, 2011, OPTICALLY AMPLIFIED WDM NETWORKS, P47, DOI 10.1016/B978-0-12-374965-9.10003-2

← 1 2 →