Modeling, Analysis, and Design for Noise Suppression Using Embedded Planar Capacitors in Multilayered Printed Circuit Boards

被引：8

作者：

Zhang, Mu-Shui ^{[1
]}

Tan, Hong-Zhou ^{[1
]}

Mao, Jun-Fa ^{[2
]}

机构：

[1] Sun Yat Sen Univ, Dept Elect & Commun Engn, Sch Informat Sci & Technol, Guangzhou Higher Educ Mega Ctr, Guangzhou 510006, Guangdong, Peoples R China

[2] Shanghai Jiao Tong Univ, Key Lab, Minist Educ China, Res Design & Electromagnet Compatibil High Speed, Shanghai 200240, Peoples R China

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2014年 / 4卷 / 05期

关键词：

Electromagnetic bandgap (EBG) structure; embedded capacitor; power noise suppression; printed circuit board (PCB); POWER-BUS; IMPEDANCE; NETWORKS;

D O I：

10.1109/TCPMT.2013.2296296

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, an accurate and fast method is presented for the modeling, analysis, and design of the power noise suppression using embedded planar capacitors in high-speed multilayered printed circuit boards (PCBs). Two main contributions of this paper are: 1) an ideal AC short circuit model is proposed to simplify the stopband analysis and a physics-based formula is derived for accurate stopband estimation and 2) a physics-based equivalent circuit modeling method is introduced for the fast estimation of noise suppression level in complicated multilayered structures. The results are verified by simulation and measurement. Our method changes the analysis of complicated multiple plane pairs into single plane pair, which can greatly simplify the design process of embedded planar capacitors in complicated multilayered PCBs.

引用

页码：882 / 891

页数：10

共 20 条

[1] Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits
Abhari, R
Eleftheriades, GV
[J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (06) : 1629 - 1639
[2] Bogatin Eric, 2009, SIGNAL POWER INTEGRI
[3] DC power-bus noise isolation with power-plane segmentation
Cui, W
Fan, J
Ren, Y
Shi, H
Drewniak, JL
DuBroff, RE
[J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2003, 45 (02) : 436 - 443
[4] De Paulis F., 2012, IEEE ELECTROMAGN COM, V2, P82
[5] Fan J, 2002, IEEE T ADV PACKAGING, V25, P154, DOI 10.1109/FADVP.2002.804723
[6] Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG Structures
Huang, Chun-Hsiang
Wu, Tzong-Lin
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2013, 3 (01): : 21 - 30
[7] HUBING T, 1999, P INT S EL COMP SEAT, P1
[8] A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface
Kamgaing, T
Ramahi, OM
[J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2003, 13 (01) : 21 - 23
[9] Suppression of GHz, range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs
Kim, H
Sun, BK
Kim, J
[J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2004, 14 (02) : 71 - 73
[10] Hybrid analytical modeling of noise coupling to signal traces in a power bus with embedded film capacitor
Kim, Jingook
Jeong, Youchul
Kim, Jaemin
Kim, Joungho
[J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2006, 16 (10) : 534 - 536

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