Surface termination and hydrogen bubble surfaces during anisotropic dissolution adhesion on Si(100) in aqueous KOH

被引:35
作者
Haiss, Wolfgang
Raisch, Philipp
Bitsch, Lennart
Nichols, Richard J.
Xia, Xinghua
Kelly, John J.
Schiffrin, David J.
机构
[1] Univ Liverpool, Dept Chem, Liverpool L69 7ZD, Merseyside, England
[2] Univ Utrecht, Debye Inst, NL-3508 TA Utrecht, Netherlands
基金
英国工程与自然科学研究理事会;
关键词
silicon etching; bubble adhesion; micromachining; anisotropic etching; FTIR spectroscopy; Si(100); Hillock formation;
D O I
10.1016/j.jelechem.2006.07.027
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
The formation and growth of hydrogen bubbles on a Si(100) surface during its anisotropic etching in aqueous KOH has been investigated. Quantitative data on bubble size, lifetime and density on the etching surface was obtained and their dependence on KOH concentration, applied potential and temperature were measured. In situ FTIR measurements demonstrated a strong dependence of bubble attachment on surface termination and hence on the hydrophilicity of the Si(100) surface during etching. The formation of surface defects and the geometry of bubble imprints have been directly characterised with scanning probe microscopy. The analysis of hillock formation and statistical considerations show that the adhesion of hydrogen bubbles during anisotropic etching of silicon is a source of surface roughness and pyramid formation. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:1 / 12
页数:12
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