共 40 条
[2]
Flip chip assembly of thinned silicon die on flex substrates
[J].
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING,
2008, 31 (01)
:1-8
[5]
Ultra-thin electronic device package
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2000, 23 (01)
:22-26
[8]
Detemple P., 2012, NEUWALK PROJECT REP, P25
[9]
DONALDSON ND, 1986, MED BIOL ENG COMPUT, V24, P41, DOI 10.1007/BF02441604