GaN/AlGaN high electron mobility transistors with fτ of 110GHz

被引:93
作者
Micovic, M [1 ]
Nguven, NX [1 ]
Janke, P [1 ]
Wong, WS [1 ]
Hashimoto, P [1 ]
McCray, LM [1 ]
Nguyen, C [1 ]
机构
[1] HRL Labs LLC, Malibu, CA 90265 USA
关键词
D O I
10.1049/el:20000296
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The performance of 50nm gate length GaN/AlGaN HEMTs is reported. The device layers were grown by MBE directly onto an SiC substrate. Devices exhibit a maximum drain current density of 1.2A/mm. an extrinsic f(tau) of 110GHz and an f(max) of over 140GHz. The f(tau), of 110GHz is the highest reported to date for a GaN/AlGaN HEMT, a nearly 50% increase over the previous record.
引用
收藏
页码:358 / 359
页数:2
相关论文
共 8 条
[1]  
CHU K, IN PRESS IEEE ELECTR
[2]   GaN materials for high power microwave amplifiers [J].
Eastman, LF ;
Chu, K ;
Smart, J ;
Shealy, JR .
WIDE-BANDGAP SEMICONDUCTORS FOR HIGH POWER, HIGH FREQUENCY AND HIGH TEMPERATURE, 1998, 512 :3-7
[3]   AlGaN/GaN double heterostructure channel modulation doped field effect transistors (MODFETs) [J].
Fan, ZF ;
Lu, CZ ;
Botchkarev, AE ;
Tang, H ;
Salvador, A ;
Aktas, O ;
Kim, W ;
Morkoc, H .
ELECTRONICS LETTERS, 1997, 33 (09) :814-815
[4]   AlGaN-GaN heterostructure FETs with offset gate design [J].
Gaska, R ;
Chen, Q ;
Yang, J ;
Khan, MA ;
Shur, MS ;
Ping, A ;
Adesida, I .
ELECTRONICS LETTERS, 1997, 33 (14) :1255-1257
[5]   High-power microwave GaN/AlGaN HEMT's on semi-insulating silicon carbide substrates [J].
Sheppard, ST ;
Doverspike, K ;
Pribble, WL ;
Allen, ST ;
Palmour, JW ;
Kehias, LT ;
Jenkins, TJ .
IEEE ELECTRON DEVICE LETTERS, 1999, 20 (04) :161-163
[6]  
Wang R., 1996, 1996 International Conference on GaAs Manufacturing Technology. Digest of Papers, P46
[7]  
WU Y, 1997, 55 ANN DEV RES C FOR
[8]   Short-channel Al0.5Ga0.5N/GaN MODFETs with power density >3W/mm at 18GHz [J].
Wu, YF ;
Keller, BP ;
Fini, P ;
Pusl, J ;
Le, M ;
Nguyen, NX ;
Nguyen, C ;
Widman, D ;
Keller, S ;
Denbaars, SP ;
Mishra, UK .
ELECTRONICS LETTERS, 1997, 33 (20) :1742-1743