Add-on process modules - an economic enhancement for high-frequency silicon technology

被引：0
|
作者：
Burghartz, JN [1 ]
机构：
[1] Delft Univ Technol, EWI, NL-2600 GA Delft, Netherlands
来源：
2004 24TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, PROCEEDINGS, VOLS 1 AND 2 | 2004年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Add-on process modules as enhancements for standard high-frequency silicon integration processes are discussed. Such modules can be added without any interference with the core process before (pre-process modules), during (mid-process modules), or after (post-process modules) the circuit integration. High-resistivity silicon substrates, bulk micromachining, and Saddle-Add-on Metallization (SAM) are presented as examples in those categories.
引用
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页码：81 / 88
页数：8
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