Ultra-thin Image Sensor Chip Embeded Foil

被引：90
作者：
Wang, S. [1 ]
Albrecht, B.
Harendt, C.
Spuentrup, J. D. Schulze
Burghartz, J. N.
机构：
[1] Inst Nano & Mikroelekt Syst INES, Pfaffenwaldring 47, D-70569 Stuttgart, Germany
来源：
PROCEEDINGS OF THE 2021 IEEE INTERNATIONAL CONFERENCE ON FLEXIBLE AND PRINTABLE SENSORS AND SYSTEMS (FLEPS) | 2021年
关键词：
Flexible electronics; bendable image sensor; HySiF; chip placement; topography planarization;
D O I：
10.1109/FLEPS51544.2021.9469747
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Hybrid Systems in Foil (HySiF) is an integration concept for high-performance and large-area flexible electronics. The technology allows for integrating ultra-thin chips and widely distributed electronic components, such as sensors, microcontrollers or antennas, in thin flexible polymer film, using CMOS-compatible equipment and processing. This paper focuses on the embedding and characterization of a bendable ultra-thin image sensor in flexible polymer foil.
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页数：4
相关论文
共 11 条
  • [1] Adaptive Layout Technique for Microhybrid Integration of Chip-Film Patch
    Alavi, Golzar
    Sailer, Holger
    Albrecht, Bjoern
    Harendt, Christine
    Burghartz, Joachim N.
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (05): : 802 - 810
  • [2] Albrecht B, 2018, 2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)
  • [3] Burghartz JN, 2011, ULTRA-THIN CHIP TECHNOLOGY AND APPLICATIONS, P1, DOI 10.1007/978-1-4419-7276-7
  • [4] Hybrid Systems-in-Foil-Combining the Merits of Thin Chips and of Large-Area Electronics
    Burghartz, Joachim N.
    Alavi, Golzar
    Albrecht, Bjoern
    Deuble, Thomas
    Elsobky, Mourad
    Ferwana, Saleh
    Harendt, Christine
    Mahsereci, Yigit
    Richter, Harald
    Yu, Zili
    [J]. IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2019, 7 (01): : 776 - 783
  • [5] Burghartz JN, 2018, 2018 INTERNATIONAL FLEXIBLE ELECTRONICS TECHNOLOGY CONFERENCE (IFETC)
  • [6] Ultra-Thin Chips and Related Applications, A New Paradigm in Silicon Technology
    Burghartz, Joachim N.
    Appel, Wolfgang
    Harendt, Christine
    Rempp, Horst
    Richter, Harald
    Zimmermann, Martin
    [J]. 2009 PROCEEDINGS OF ESSCIRC, 2009, : 29 - 36
  • [7] A digital library for a flexible low-voltage organic thin-film transistor technology
    Elsobky, Mourad
    Elattar, Mohamed
    Alavi, Golzar
    Letzkus, Florian
    Richter, Harald
    Zschieschang, Ute
    Strecker, Michael
    Klauk, Hagen
    Burghartz, Joachim N.
    [J]. ORGANIC ELECTRONICS, 2017, 50 : 491 - 498
  • [8] Ultra-thin chips for high-performance flexible electronics
    Gupta, Shoubhik
    Navaraj, William Taube
    Lorenzelli, Leandro
    Dahiya, Ravinder
    [J]. NPJ FLEXIBLE ELECTRONICS, 2018, 2 (01)
  • [9] Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips
    Harendt, Christine
    Kostelnik, Jan
    Kugler, Andreas
    Lorenz, Enno
    Saller, Stefan
    Schreivogel, Alina
    Yu, Zili
    Burghartz, Joachim N.
    [J]. SOLID-STATE ELECTRONICS, 2015, 113 : 101 - 108
  • [10] Hu Jupiter, 2010, 2010 28th VLSI Test Symposium (VTS 2010), DOI 10.1109/VTS.2010.5469608
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