Low-power logic circuit and SRAM cell applications with silicon on depletion layer CMOs (SODEL CMOS) technology

被引:2
作者
Inaba, Satoshi [1 ]
Nagano, Hajime
Miyano, Kiyotaka
Mizushima, Ichiro
Okayama, Yasunori
Nakauchi, Takahiro
Ishimaru, Kazunari
Ishiuchi, Hidemi
机构
[1] Toshiba Co Ltd, Semicond Co, SOC Res & Dev Ctr, Yokohama, Kanagawa 2358522, Japan
[2] Toshiba Co Ltd, Semicond Co, Proc & Mfg Engn Ctr, Yokohama, Kanagawa 2358522, Japan
[3] Toshiba Co Ltd, Semicond Co, Mobile Memory Device Engn Div, Yokohama, Kanagawa 2478585, Japan
关键词
body effect; CMOS digital integrated circuits; epitaxial growth; logic circuits; MOS devices; semiconductor junctions; silicon on insulator technology; SPICE; SRAM chips;
D O I
10.1109/JSSC.2006.874335
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the switching performance of Silicon on Depletion Layer CMOS (SODEL CMOS) [1] is investigated with a view to realizing high-speed and low-power CMOS applications. Thanks to smaller parasitic capacitance, the propagation delay time (tau(pd)) in SODEL CMOS has been improved by up to 25% compared to that of conventional bulk CMOS in five stacked nFET inverters at the same Vdd. It is also confirmed that about 30% better power-delay product can be realized at the same -rpd with reduced Vdd in SODEL CMOS. In SRAM cell applications, SODEL CMOS shows high Static Noise Margin (SNM) of similar to 95 mV at V-dd = 0.6 V. Smaller bit-line delay is expected and confirmed in SODEL CMOS SRAM by SPICE simulations. Latch-up immunity for a-particle irradiation in SODEL CMOS was also found to be comparable to that of conventional bulk CMOS. Therefore, SODEL CMOS device and circuit technology is expected to provide a better solution for low-power system-on-a-chip (SoC).
引用
收藏
页码:1455 / 1462
页数:8
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