Ultrafine grained copper alloy sheets having both high strength and high electric conductivity

被引：174

作者：

Takata, Naoki ^{[1
]}

Lee, Seong-Hee ^{[2
]}

Tsuji, Nobuhiro ^{[3
]}

机构：

[1] Tokyo Inst Technol, Dept Met & Ceram Sci, Grad Sch Sci & Engn, Meguro Ku, Tokyo 1528552, Japan

[2] Mokpo Natl Univ, Dept Adv Mat Sci & Engn, Jeonnam, South Korea

[3] Kyoto Univ, Dept Mat Sci & Engn, Grad Sch Engn, Sakyo Ku, Kyoto 6068501, Japan

来源：

MATERIALS LETTERS | 2009年 / 63卷 / 21期

关键词：

Severe plastic deformation; Accumulative roll bonding; Mechanical property; Electrical property; Grain size; PURE COPPER; MICROSTRUCTURE; DUCTILITY; ARB; ALUMINUM; TEXTURE; CU;

D O I：

10.1016/j.matlet.2009.05.021

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The ultrafine grained (UFG) microstructure, mechanical properties and electric conductivity of the Cu alloys severely deformed by accumulative roll bonding (ARB) process were systematically investigated. High density of grain boundaries introduced by the ARB process has significant effect on strengthening but little effect on the electric conductivity. The UFG Cu alloys with submicometer grain sizes can achieve both superior mechanical properties and high electric conductivity. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：1757 / 1760

页数：4

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