Investigation on moisture diffusion in COB packaging

被引：0

作者：

Huang, WD ^{[1
]}

Wang, XH ^{[1
]}

Wang, L ^{[1
]}

Sheng, M ^{[1
]}

Xu, LQ ^{[1
]}

Stubhan, F ^{[1
]}

Luo, L ^{[1
]}

机构：

[1] DaimlerChrysler SIM Technol Co Ltd, Shanghai 200050, Peoples R China

来源：

FIFTH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, PROCEEDINGS | 2003年

关键词：

plastic encapsulation; humidity sensor; moisture diffusion; coatings; FEA;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The moisture diffusion in globtop material, globtop coated with SiNx film, globtop coated with silicone and globtop coated with SiNx plus silicone were measured by humidity sensors wire-bonded on FR4 boards in three different temperature/humidity environments. The experimental results were simulated by Finite Element Method and Fick diffusion law. The moisture diffusion coefficients were calculated to quantitatively compare various coatings' moisture-resistance. Our experiment and simulation results show that double-layered coating with SiNx plus silicone has excellent moisture-resistance because it not only can smooth the steps on PCB but also keep the good moisture-resistance of inorganic films.

引用

页码：392 / 395

页数：4

共 9 条

[1] ANANT G, 1990, VLSI RELIABILITY
[2] *BEIJ U DEP MATH, 1976, ORTH DES
[3] Hagen D., 1997, International Journal of Microcircuits and Electronic Packaging, V20, P460
[4] Overview of conductive adhesive interconnection technologies for LCD's
Kristiansen, H
Liu, J
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (02): : 208 - 214
[5] LUO S, 2001, 2001 INT S EL PACK T, V133
[6] PECHT MG, 1999, IEEE T COMPONENTS PA, V22
[7] Plasma deposition of Si-N and Si-O passivation layers on three-dimensional sensor devices
Schmid, P
Orfert, M
Vogt, M
[J]. SURFACE & COATINGS TECHNOLOGY, 1998, 98 (1-3) : 1510 - 1517
[8] ULRICH RK, 1991, IEEE, P738
[9] WARYOLD J, 1998, SMT MAR, P22

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