共 50 条
- [2] Experimental studies of pitching vibration of ultrasonic bonder transducer Zhongguo Jixie Gongcheng/China Mechanical Engineering, 2008, 19 (10): : 1228 - 1232
- [3] Effect of contact interface in transducer system in ultrasonic bonding HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION, 2007, : 287 - +
- [4] Vibration simulation of transducer system in thermosonic wire bonding PROCEEDINGS OF THE SEVENTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN, PACKAGING AND FAILURE ANALYSIS (HDP'05), 2005, : 419 - 425
- [5] Dynamic Current Characteristic of Ultrasonic Transducer for Wire Bonding 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 897 - 901
- [6] Impedance/admittance model of ultrasonic transducer system in thermosonic bonding Jixie Gongcheng Xuebao, 2007, 10 (14-19):
- [7] Dynamics of Ultrasonic Transducer System for Thermosonic Flip Chip Bonding IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 32 (02): : 261 - 267
- [8] Non-steady characteristics of ultrasonic bonding transducer system Hanjie Xuebao/Transactions of the China Welding Institution, 2006, 27 (08): : 19 - 22
- [10] Effects of Bonding Pressure on Nonlinear Dynamic Characteristic of the Ultrasonic Wire Bonding System 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 778 - 782