Glass-Copper anodic bonding through activated Sn-0.6Al solder

被引：14
作者：
Feng, Guangjie [1 ,2 ]
Li, Zhuoran [1 ]
Xu, Xiaolong [1 ]
Shen, Zhongke [1 ]
Yang, Yong [2 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Heilongjiang, Peoples R China
[2] Univ Maryland, Dept Chem & Biomol Engn, College Pk, MD 20742 USA
来源：
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | 2018年 / 254卷
基金：
中国国家自然科学基金;
关键词：
Glass; Copper; Anodic bonding; Sodium-depleted region; Formation mechanism; HIGH-TEMPERATURE SYNTHESIS; C-F/AL COMPOSITES; TIAL ALLOYS; TIN SOLDER; METAL; JOINTS; MICROSTRUCTURE; MECHANISMS;
D O I：
10.1016/j.jmatprotec.2017.11.038
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The application of an electric field promoted the migration of Na+ ions on the glass substrate. A sodium-depleted layer was formed on the glass surface, playing a key role in a successful bonding. Al accumulated at the glass/solder interface and enhanced the interfacial reactions. Al2O3 + Al2SiO5 + SnO, Cu6Sn5 and Cu3Sn reaction layers were respectively detected on both sides. The electric field and bonding temperature were varied to illustrate their impact on the interfacial bonding. The joint formation mechanism is discussed. When the bonding voltage was 1400 V and the bonding temperature was 400 degrees C, the glass/copper joint was free of cracks, and had a maximum shear strength of 11.5 MPa.
引用
收藏
页码：108 / 113
页数：6
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