Pb-free surface-finishing on electronic components' terminals for Pb-free soldering assembly

被引：12
|
作者：
Tanaka, H [1 ]
Tanimoto, M [1 ]
Matsuda, A [1 ]
Uno, T [1 ]
Kurihara, M [1 ]
Shiga, S [1 ]
机构：
[1] Furukawa Elect Corp Ltd, Div R&D, Met Res Ctr, Nikko 3210942, Japan
来源：
JOURNAL OF ELECTRONIC MATERIALS | 1999年 / 28卷 / 11期
关键词：
Pb-free surface-finishing; Sn-Bi with Sn undercoat; Pd with Ni undercoat;
D O I：
10.1007/s11664-999-0160-5
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Pb-free solderable surface finishing is essential to implement Pb-free solder assembly in order to meet with the growing demand of environmental consciousness to eliminate Pb from electronic products. Two types of widely applicable Pb-free surface finishing technologies are developed. One is the multilayer-system including Pd with Ni undercoat. Heat-resistance of Pd enables whole-surface-plating on to leadframe before IC-assembling process. The other is the double-layer-system with low-melting-point-materials, for example, thicker Sn underlayer and thinner Sn-Bi alloy overlayer, dilutes Sn-Bi alloy's defects of harmful reactivity along with substrate metal and mechanical brittleness with keeping its advantages of solder-wettability and no whisker.
引用
收藏
页码：1216 / 1223
页数：8
相关论文
共 50 条
  • [1] Pb-free surface-finishing on electronic components’ terminals for Pb-free soldering assembly
    Hitoshi Tanaka
    Morimasa Tanimoto
    Akira Matsuda
    Takeo Uno
    Masaaki Kurihara
    Shoji Shiga
    Journal of Electronic Materials, 1999, 28 : 1216 - 1223
  • [2] Implementing Pb-free soldering
    Anderson, Iver E.
    Kirkland, Kenneth
    Willenberg, Wayne
    Surface mount technology, 2000, 14 (11): : 78 - 81
  • [3] Dynamics in Pb-free wave soldering
    Celestica Corp.
    不详
    不详
    Circ Assem, 2006, 2 (76-83):
  • [4] Guidelines for Pb-free hand soldering
    Whiteman, Lee
    Northam, Riley
    Circuits Assembly, 2005, 16 (09): : 48 - 51
  • [5] Pb-free defects and mitigation : Common problems of Pb-free soldering, and how to solve them
    Vitronics Soltec BV
    Circ Assem, 2006, 2 (86):
  • [6] Pb-free resistor for Pb-free LTCC system
    Fukaya, M
    Higuchi, C
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 636 - 641
  • [7] Consumption of soldering iron by Pb-free solder
    Sueyoshi, Hidekazu
    Odo, Harunori
    Mizokuchi, Shinji
    Abe, Shigeru
    Saikusa, Kazuya
    MATERIALS TRANSACTIONS, 2006, 47 (04) : 1221 - 1226
  • [8] Present status of transition to Pb-free soldering
    Illyefalvi-Vitéz, Z
    Pinkola, J
    Harsányi, G
    Dominkovics, C
    Illes, B
    Tersztyánszky, L
    2005 28TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2005, : 72 - 77
  • [9] Wettability Studies of Pb-Free Soldering Materials
    Z. Moser
    W. Gąsior
    J. Pstruś
    A. Dębski
    International Journal of Thermophysics, 2008, 29 : 1974 - 1986
  • [10] LEADOUT training course on Pb-free soldering
    Illyefalvi-Vitez, Zsolt
    Mason, Simon
    Freitas, Marta
    2006 29TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2006, : 378 - +
12345