Temperature Dependence and Temperature-Aware Sensing in Ferroelectric FET

被引:37
作者
Gupta, Aniket [1 ]
Ni, Kai [2 ]
Prakash, Om [4 ]
Hu, X. Sharon [3 ]
Amrouch, Hussain [4 ]
机构
[1] Natl Inst Technol Uttarakhand, Srinagar, Uttarakhand, India
[2] Rochester Inst Technol, Microsyst Engn, Rochester, NY 14623 USA
[3] Univ Notre Dame, Dept Comp Sci & Engn, Notre Dame, IN 46556 USA
[4] Karlsruhe Inst Technol KIT, Dept Comp Sci, Karlsruhe, Germany
来源
2020 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) | 2020年
关键词
Ferroelectric; FeFET; Nonvolatile Memory; NVM; TCAD; Reliability; Temperature; Emerging Technology;
D O I
10.1109/irps45951.2020.9129226
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The temperature dependence of Ferroelectric FET (FeFET) at the 14nm technology node has been studied thoroughly through well-calibrated TCAD modeling for 3D FinFET devices. We demonstrate, for the first time, that: 1) the degradation of FeFET (i.e., reduction in sensing current during reading) with temperature increase comes mostly from the ferroelectric degradation (i.e., reductions in the coercive field and polarization), while marginally from the degradation in the underlying FinFET (i.e. changes in electrostatics and carrier transport properties); 2) the drain current reduction caused by the ferroelectric degradation can be partially compensated with the current boost induced by the degradation in electrostatics and carrier transport properties. Therefore, the read voltage of FeFET based nonvolatile memory (NVM) can be carefully selected to mitigate deleterious effects of temperature variation during runtime.
引用
收藏
页数:5
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