Parametric and nonparametric description of the surface topography in the dry and MQCL cutting conditions

被引:142
作者
Krolczyk, G. M. [1 ]
Maruda, R. W. [2 ]
Krolczyk, J. B. [1 ]
Nieslony, P. [1 ]
Wojciechowski, S. [3 ]
Legutko, S. [3 ]
机构
[1] Opole Univ Technol, Fac Mech Engn, 76 Proszkowska St, PL-45758 Opole, Poland
[2] Univ Zielona Gora, Fac Mech Engn, 4 Prof Z Szafrana St, PL-65516 Zielona Gora, Poland
[3] Poznan Univ Tech, Fac Mech Engn & Management, 3 Piotrowo St, PL-60965 Poznan, Poland
关键词
Environmentally friendly processes; Dry machining; MQL/MQCL; Duplex stainless steel; Surface roughness; Clean production; Surface quality; ROUGHNESS; STEEL; INSPECTION;
D O I
10.1016/j.measurement.2018.02.052
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper focuses on the parametric and nonparametric description of surface topography after turning in the dry and MQCL conditions. The carried out research involved the longitudinal turning tests of duplex stainless steel, conducted in a range of variable cutting speeds vc and feeds f. Surface topography measurements were conducted with the application of Infinite Focus G4 microscope. In the first stage of research, the parametric analysis of the machined surfaces has been conducted. It included the evaluation of amplitude surface roughness parameters. In the next stage the nonparametric description of machined surfaces was carried out. This analysis has been focused on the presentation of machined surfaces in the form of contour maps and isometric images. The last stage of experiment involved the evaluation of surface isotropy and formulation of material ratio charts. The conducted research shows that the application of MQCL method can lead to the reduction of 3D surface roughness parameters compared to values reached after the dry machining. Moreover, the better distribution of irregularity peaks and pits under the MQCL method, comparing to that obtained after dry cutting implies that surfaces machined with the use of MQCL technique can be characterized by a high wear resistance.
引用
收藏
页码:225 / 239
页数:15
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