Improving the Process Variation Tolerability of Flip-Flops for UDSM Circuit Design

被引:0
|
作者
Hwang, Eun Ju [1 ]
Kim, Wook [1 ]
Kim, Young Hwan [1 ]
机构
[1] Pohang Univ Sci & Technol POSTECH, Pohang, South Korea
来源
PROCEEDINGS OF THE ELEVENTH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED 2010) | 2010年
关键词
Flip-flop; Process variation; Tolerability; Functional yield; Variability; IMPACT;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The process variation of the ultra-deep submicron technology causes significant variation in the timing characteristics of flip-flops, and it can drop functional yield seriously, affecting system timing. This paper has two objectives. First, this paper investigates the sensitivities to process variation of four representative flip-flop architectures that are popularly used in digital circuit designs in respect of their functional robustness. Secondly, this paper proposes simple but effective methods to improve the process variation tolerability of those flip-flops. Experimental results on four benchmark flip-flops, which were optimized for minimum power-delay product, show that their variability of data-to-q delay reaches to 33.02% similar to 46.13% and functional yield reaches to 79.93% similar to 99.86%. Also, the experimental results clearly show that the proposed approaches improve the variability of data-to-q delay by 11.53% similar to 44.78% and functional yield by 0.11% similar to 24.41%.
引用
收藏
页码:812 / 817
页数:6
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