Low cycle fatigue study of lead free 99.3Sn-0.7Cu solder alloy

被引：72

作者：

Pang, JHL ^{[1
]}

Xiong, BS ^{[1
]}

Low, TH ^{[1
]}

机构：

[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore

来源：

INTERNATIONAL JOURNAL OF FATIGUE | 2004年 / 26卷 / 08期

关键词：

fatigue; frequency effect; lead free; low cycle fatigue; morrow; Sn-0.7Cu; solder;

D O I：

10.1016/j.ijfatigue.2003.12.004

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

In this paper, low cycle fatigue studies on 99.3Sn-0.7Cu lead free solder was evaluated over a range of test temperatures (298, 348 and 398 K) and frequencies (10(-3)-1 Hz), tested at four values of total strain range (2, 3.5, 5 and 7.5%). The fatigue performance of lead free 99.3Sn-0.7Cu solder was compared to 63Sn-37Pb solder. The effects of temperature and frequency on the low cycle fatigue life were discussed and were presented in Coffin-Manson and Morrow model relationships. Frequency modified Coffin-Manson and Morrow models were proposed for predicting the effect of frequency on low cycle fatigue life of 99.3Sn-0.7Cu solder alloy. (C) 2004 Elsevier Ltd. All rights reserved.

引用

页码：865 / 872

页数：8

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