Fine-line conductor manufacturing using drop-on-demand PZT printing technology

被引:143
作者
Szczech, JB
Megaridis, CM
Gamota, DR
Zhang, J
机构
[1] Univ Illinois, Dept Mech Engn, Chicago, IL 60607 USA
[2] Motorola Labs, Schaumburg, IL 60196 USA
来源
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 2002年 / 25卷 / 01期
关键词
circuit interconnects; droplet impact; drop-on-demand; ink jet printing; metallic nano-particle suspension; selective metallization;
D O I
10.1109/TEPM.2002.1000480
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An emerging selective metallization process to fabricate fine-line conductors based on drop-on-demand (DOD) ink jet printing and novel nano-particle fluid suspensions (NPFS) was studied. The suspensions consist of 1-10 nm silver or gold particulates that are homogeneously suspended in an organic carrier. A piezo-electric droplet generator driven by a bipolar voltage signal is used to dispense 50-70 mum diameter droplets traveling at 1-3 m/s before impacting a compliant polyimide substrate. The deposit/substrate composite is subsequently processed at 300degreesC for 15 min to allow for complete evaporation of the carrier and for sintering of the nano-particles, thereby yielding a finished circuit interconnect. Test vehicles created using this technique exhibit features as fine as 120 mum wide and 1 mum thick with resistivities on the order of 3.5 x 10(-5) Omegacm. The circuitry performed well under environmental conditioning. As expected, repeatability of circuitry fabrication showed sensitivity to the generation of steady, satellite-free droplets. In an effort to generate droplets consistently, it is essential to develop a strong fundamental understanding of the correlation between device excitation parameters and dispensed fluid properties, and to resolve the microrheological behavior of the NPFS when flowing through the droplet generator.
引用
收藏
页码:26 / 33
页数:8
相关论文
共 13 条
  • [1] Solder-jetted eutectic PbSn bumps for flip-chip
    Baggerman, AFJ
    Schwarzbach, D
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1998, 21 (04): : 371 - 381
  • [2] Polymer electroluminescent devices processed by inkjet printing: I. Polymer light-emitting logo
    Bharathan, J
    Yang, Y
    [J]. APPLIED PHYSICS LETTERS, 1998, 72 (21) : 2660 - 2662
  • [3] EXPERIMENTAL AND THEORETICAL-STUDY OF WAVE-PROPAGATION PHENOMENA IN DROP-ON-DEMAND INK JET DEVICES
    BOGY, DB
    TALKE, FE
    [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1984, 28 (03) : 314 - 321
  • [4] SIZE EFFECT ON MELTING TEMPERATURE OF GOLD PARTICLES
    BUFFAT, P
    BOREL, JP
    [J]. PHYSICAL REVIEW A, 1976, 13 (06) : 2287 - 2298
  • [5] COTTON CD, P 1999 INT C HIGH DE, P114
  • [6] DESIGN CRITERIA AND FUTURE-DIRECTIONS IN INKJET INK TECHNOLOGY
    CROUCHER, MD
    HAIR, ML
    [J]. INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, 1989, 28 (11) : 1712 - 1718
  • [7] Hydro-acoustics of piezoelectrically driven ink-jet print heads
    Dijksman, JF
    [J]. FLOW TURBULENCE AND COMBUSTION, 1998, 61 (1-4) : 211 - 237
  • [8] HYDRODYNAMICS OF SMALL TUBULAR PUMPS
    DIJKSMAN, JF
    [J]. JOURNAL OF FLUID MECHANICS, 1984, 139 (FEB) : 173 - 191
  • [9] Ink-jet printing of doped polymers for organic light emitting devices
    Hebner, TR
    Wu, CC
    Marcy, D
    Lu, MH
    Sturm, JC
    [J]. APPLIED PHYSICS LETTERS, 1998, 72 (05) : 519 - 521
  • [10] Jawitz M. W., 1997, PRINTED CIRCUIT BOAR