Research on Modeling of Cutting Wire Deflection of Multi-wire Saw

被引：0
|
作者：
Tang, R. [1 ]
Dai, Y. X. [1 ]
Zhang, Y. B. [1 ]
Yuan, J. L. [2 ]
Xiong, W. L. [2 ]
机构：
[1] Hunan Univ, Coll Elect & Informat Engn, Changsha 410082, Hunan, Peoples R China
[2] Hunan Univ, Natl Engn Res Ctr High Efficiency Grinding, Changsha 410082, Hunan, Peoples R China
来源：
ULTRA-PRECISION MACHINING TECHNOLOGIES | 2009年 / 69-70卷
关键词：
Process modeling; Cutting wire deflection; Multi-wire saw;
D O I：
10.4028/www.scientific.net/AMR.69-70.343
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
The deflection of cutting wire on multi-wire saw is determined by cutting wire tension, diameter ingot feed force and some other factors, and it affects the quality of silicon wafers greatly. In this paper, the initial stage of cutting process is analyzed and modeled with three ODES. Then the numerical solutions are solved by finding out the BVPs of each ODE. The numerical solutions showed the relationship between the deflection and the cutting parameters such as cutting wire tension, diameter and ingot feed force. This method is helpful for the further research of modeling the entire cutting process.
引用
收藏
页码：343 / +
页数：2
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