CO2 laser cleavage of chemically strengthened glass

被引:11
作者
Furumoto, Tatsuaki [1 ]
Hashimoto, Yohei [2 ]
Ogi, Hisashi [3 ]
Kawabe, Tomoya [3 ]
Yamaguchi, Mitsugu [1 ]
Koyano, Tomohiro [2 ]
Hosokawa, Akira [1 ]
机构
[1] Kanazawa Univ, Adv Mfg Technol Inst AMTI, Kakuma Machi, Kanazawa, Ishikawa 9201192, Japan
[2] Kanazawa Univ, Fac Mech Engn, Inst Sci & Engn, Kakuma Machi, Kanazawa, Ishikawa 9201192, Japan
[3] Kanazawa Univ, Grad Sch Nat Sci & Technol, Div Mech Sci & Engn, Kakuma Machi, Kanazawa, Ishikawa 9201192, Japan
关键词
Thermal stress cleavage; Chemically strengthened glass; Carbon dioxide laser; Initial crack; Thermal stress distribution; Diode-pumped solid-state laser; SEPARATION; PRECISION;
D O I
10.1016/j.jmatprotec.2020.116961
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
It is necessary to strengthen glass surfaces to protect mobile electric devices from unexpected scratches and breakages, and various strengthening methods are available to this end. However, strengthened glass is difficult to cut and finish owing to the high compressive stress on the glass surface. In this work, chemically strengthened glass was separated using a fracture control technique. The initial crack for the crack propagation was generated through a thermal shock induced by laser beam irradiation, and the thermal stress distribution inside the strengthened glass was simulated via a finite element analysis. In addition, the influence of the laser conditions on the cleavage characteristics was evaluated experimentally, and a groove was fabricated via a short-pulsed laser to improve the quality of the cleaved surface. The thermal stress induced by the laser beam irradiation was affected by the stress distribution inside the strengthened glass, and the depth of the initial crack was required to exceed that of the compressive stress layer to realize the crack propagation through laser beam irradiation. The minimum energy density required for the thermal stress cleavage decreased with the increase in the initial crack depth, and the energy density required for the thermal stress cleavage was large when the compressive stress on the surface was high. The compressive stress layer on the surface helped reduce the lateral crack at the tip of the initial crack, and the tensile stress inside the specimen helped realize high-quality cleavage. In addition, the groove fabricated using the short-pulsed laser acted as the initial point for the crack propagation and helped prevent the thermal damage induced by the laser beam irradiation applied as the heat source.
引用
收藏
页数:9
相关论文
共 33 条
  • [21] Mizobuchi A., 2016, Int. J. Automation Technol., V10, P780, DOI [10.20965/ijat.2016.p0780, DOI 10.20965/IJAT.2016.P0780]
  • [22] Ultrasonic vibration-assisted machining of chemically strengthened glass with workpiece bending
    Noma, Kazuki
    Kakinuma, Yasuhiro
    Aoyama, Tojiro
    Hamada, Seiji
    [J]. JOURNAL OF ADVANCED MECHANICAL DESIGN SYSTEMS AND MANUFACTURING, 2015, 9 (02):
  • [23] High-Precision and High-Efficiency Micromachining of Chemically Strengthened Glass Using Ultrasonic Vibration
    Noma, Kazuki
    Takeda, Yu
    Aoyama, Tojiro
    Kakinuma, Yasuhiro
    Hamada, Seiji
    [J]. 6TH CIRP INTERNATIONAL CONFERENCE ON HIGH PERFORMANCE CUTTING (HPC2014), 2014, 14 : 389 - 394
  • [24] Study on thermal stress cleavage of chemically strengthened glass by CO2 laser beam
    Ogi, Hisashi
    Furumoto, Tatsuaki
    Koyano, Tomohiro
    Hosokawa, Akira
    [J]. 18TH CIRP CONFERENCE ON ELECTRO PHYSICAL AND CHEMICAL MACHINING (ISEM XVIII), 2016, 42 : 460 - 463
  • [25] MIST COOLING FOR THERMAL TEMPERING OF GLASS
    OHKUBO, H
    NISHIO, S
    [J]. JSME INTERNATIONAL JOURNAL SERIES II-FLUIDS ENGINEERING HEAT TRANSFER POWER COMBUSTION THERMOPHYSICAL PROPERTIES, 1988, 31 (03): : 444 - 450
  • [26] Damage-free cutting of chemically strengthened glass by creation of sub-surface cracks using femtosecond laser pulses
    Park, Sanguk
    Kim, Yunseok
    You, Joonho
    Kim, Seung-Woo
    [J]. CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2017, 66 (01) : 535 - 538
  • [27] SAIFI MA, 1973, AM CERAM SOC BULL, V52, P838
  • [28] A study on separating of a silicon wafer with moving laser beam by using thermal stress cleaving technique
    Saman, Alias Mohd
    Furumoto, Tatsuaki
    Ueda, Takashi
    Hosokawa, Akira
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2015, 223 : 252 - 261
  • [29] Cutting thin glass by femtosecond laser ablation
    Shin, Hyesung
    Kim, Dongsik
    [J]. OPTICS AND LASER TECHNOLOGY, 2018, 102 : 1 - 11
  • [30] CO2 laser-induced weakening in chemically strengthened glass: Improvement in processability and its visualization by Raman mapping
    Terakado, Nobuaki
    Uchida, Shohei
    Sasaki, Ryusei
    Takahashi, Yoshihiro
    Fujiwara, Takumi
    [J]. CERAMICS INTERNATIONAL, 2018, 44 (03) : 2843 - 2846