Leaching behavior of copper from waste printed circuit boards with Bronsted acidic ionic liquid

被引：131

作者：

Huang, Jinxiu ^{[1
]}

Chen, Mengjun ^{[1
]}

Chen, Haiyan ^{[1
]}

Chen, Shu ^{[1
]}

Sun, Quan ^{[1
]}

机构：

[1] Southwest Univ Sci & Technol, Key Lab Solid Waste Treatment & Resource RecycleE, Minist Educ, Mianyang 621010, Peoples R China

来源：

WASTE MANAGEMENT | 2014年 / 34卷 / 02期

基金：

国家高技术研究发展计划(863计划); 中国国家自然科学基金;

关键词：

WPCBs mounted with electronic components; Copper recovery; Ionic liquid; 1-Butyl-3-methyl-imidazolium hydrogen sulfate ([bmim]HSO4); Leaching kinetics; MOBILE PHONE PCBS; RECOVERY; METALS; GOLD; PARTICLES; PYROLYSIS;

D O I：

10.1016/j.wasman.2013.10.027

中图分类号：

X [环境科学、安全科学];

学科分类号：

08 ; 0830 ;

摘要：

In this work, a Bronsted acidic ionic liquid, 1-butyl-3-methyl-imidazolium hydrogen sulfate ([bmim]HSO4), was used to leach copper from waste printed circuit boards (WPCBs, mounted with electronic components) for the first time, and the leaching behavior of copper was discussed in detail. The results showed that after the pre-treatment, the metal distributions were different with the particle size: Cu, Zn and Al increased with the increasing particle size; while Ni, Sn and Pb were in the contrary. And the particle size has significant influence on copper leaching rate. Copper leaching rate was higher than 99%, almost 100%, when 1 g WPCBs powder was leached under the optimum conditions: particle size of 0.1-0.25 mm, 25 mL 80% (v/v) ionic liquid, 10 mL 30% hydrogen peroxide, solid/liquid ratio of 1/25, 70 C and 2 h. Copper leaching by [bmim]HSO4 can be modeled with the shrinking core model, controlled by diffusion through a solid product layer, and the kinetic apparent activation energy has been calculated to be 25.36 kJ/mol. (C) 2013 Elsevier Ltd. All rights reserved.

引用

页码：483 / 488

页数：6

共 40 条

[1] The nature of catalytic activity and deactivation of chloroaluminate ionic liquid [J].