Microfocus X-ray printed circuit board inspection system

被引：20
|
作者：
Wang, Yu [1 ]
Wang, Mingquan [1 ]
Zhang, Zhijie [1 ]
机构：
[1] North Univ China, Key Lab Elect Test Technol, Minist Educ, Key Lab Instrumentat Sci & Dynam Measurement, Taiyuan 030051, Peoples R China
来源：
OPTIK | 2014年 / 125卷 / 17期
基金：
中国国家自然科学基金;
关键词：
Microfocus; X-ray; BGA; PCB inspection system; MCP intensifier;
D O I：
10.1016/j.ijleo.2014.04.027
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
In order to solve the problem of digital radiography for printed circuit board (PCB) defect inspection, a new inspection system for PCB defect inspection with high resolution X-ray is proposed and implemented in this paper. The influence of the focus size of X-ray source on imaging formation is analyzed to get the best geometrical magnification. Moreover, the relationship between the resolution of intensifier and geometrical magnification is presented by analyzing the performance of MCP-X intensifier, which results in calculating the comprehensive resolution of this system. The experiment result indicates that the measurements on defect character is achieved by inspection software, and the defect analysis accuracy on ball grid array (BGA) solder joint of circuit board achieves minimum resolution of 0.03 mm. As a result, this system succeeds in implementing invisible solder joint defect inspection on BGA. (C) 2014 Elsevier GmbH. All rights reserved.
引用
收藏
页码：4929 / 4931
页数：3
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