The effect of trace amount of Ti and W on the powder metallurgy process of Cu

被引：11

作者：

Hao, Huali ^{[1
]}

Mo, Wei ^{[1
]}

Lv, Yonghu ^{[1
]}

Ye, Shulong ^{[1
]}

Gu, Ruinan ^{[1
]}

Yu, Peng ^{[1
]}

机构：

[1] South Univ Sci & Technol China, Dept Mat Sci & Engn, Shenzhen Key Lab Nanoimprint Technol, Shenzhen 518055, Peoples R China

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2016年 / 660卷

关键词：

Copper; Titanium; Tungsten; Powder metallurgy; HEAT SINK APPLICATIONS; THERMAL-CONDUCTIVITY; CU/DIAMOND COMPOSITES; DIAMOND PARTICLES; COPPER; INFILTRATION; ALUMINUM; ALLOYS; MATRIX;

D O I：

10.1016/j.jallcom.2015.11.140

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The influence of trace elements on the powder metallurgy of Cu was investigated. It was found that 1 wt. % of Ti can effectively increase the green density of the compacts and facilitate the subsequent sintering process, thus resulting in increased sintered density. Although 1 wt. % of W added into the Cu leads to similar increasing of green density, W significantly retarded the sintering process and has a negative effect on the sintered density. Moreover, intermetallic Cu4Ti were formed, which not only creates a short-circuit diffusion path for Cu but also forms liquid phases during sintering. However, it was hardly dissolved between W and Cu. (C) 2015 Elsevier B.V. All rights reserved.

引用

页码：204 / 207

页数：4

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