Micromachining of Glass by Electrochemical Discharge Machining and Grinding

被引：0

作者：

Cao, Xuan Doan ^{[1
]}

Kim, Bo Hyun ^{[2
]}

Oh, Young Tak ^{[3
]}

Chung, Do Kwan ^{[1
]}

Chu, Chong Nam ^{[1
]}

机构：

[1] Seoul Natl Univ, Sch Mech & Aerosp Engn, Seoul 151742, South Korea

[2] Soongsil Univ, Dept Mech Engn, Seoul 156743, South Korea

[3] Ansan Coll Technol, Dept Mech Engn, Ansan, South Korea

来源：

PROCEEDINGS OF THE 16TH INTERNATIONAL SYMPOSIUM ON ELECTROMACHINING, 2010 | 2010年

关键词：

ECDM; PCD; Glass;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a hybrid method combining electrochemical discharge machining (ECDM) and micro grinding to machine micro structures on glass. First, micro structures are machined by ECDM and then ground by a polycrystalline diamond (PCD) tool to improve surface roughness. The present work shows investigations of ECDM characteristics such as the effects of the electrolyte solution, voltage, and machining feedrate. The characteristics of PCD grinding are also investigated to improve surface quality of structures without cracks. By applying this hybrid method, 3D structures on glass with good surface roughness can be machined.

引用

页码：657 / 661

页数：5

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