Morphology, Kinetics and service reliability of Cu6Sn5 texture formed on Sn/Cu interface

被引：0
|
作者：
Zhang, Zhihao [1 ]
Cao, Huijun [1 ]
Xiao, Yong [1 ]
Li, Mingyu [2 ]
机构：
[1] Harbin Inst Technol, Shenzhen Grad Sch, Shenzhen, Peoples R China
[2] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Shenzhen, Peoples R China
来源：
2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2014年
关键词：
Cu6Sn5; anisotropic growth; kinetics; hexagonal-rod shape; service reliability;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
we proposed a hexagonal-rod growth behavior to describe the growth mechanism of the intermetallic Cu6Sn5 phase inside the liquid Sn-base solder. We found that the interfacial Cu6Sn5 phase formed on Sn/Cu joint interface also has the similar characteristics in terms of the shapes and surface textures. Based on this anisotropic growth behavior, a supply-controlled kinetic model of Cu6Sn5 phase was established. In addition, this study could deepen our understanding of the solid-state phase transformation in Cu6Sn5, and also be of great significance in the interfacial reliability of solder interconnections.
引用
收藏
页码：1056 / 1059
页数：4
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