Crystalline ha coating on peek via chemical deposition

被引:69
作者
Almasi, D. [1 ]
Izman, S. [1 ]
Assadian, M. [3 ]
Ghanbari, M. [4 ]
Kadir, M. R. Abdul [2 ]
机构
[1] Univ Teknol Malaysia, Fac Mech Engn, Dept Mfg & Ind Engn, Skudai 81310, Johor, Malaysia
[2] Univ Teknol Malaysia, Fac Biosci & Med Engn, Med Devices &Technol Grp MEDITEG, Skudai 81310, Johor, Malaysia
[3] Univ Teknol Malaysia, Fac Mech Engn, Dept Mat Engn, Skudai 81310, Johor, Malaysia
[4] Univ Teknol Malaysia, Fac Petr & Renewable Energy Engn, Skudai 81310, Johor, Malaysia
关键词
PEEK; Chemical deposition; Hydroxyapatite; Surface roughness; Water contact angle; IN-VIVO EVALUATION; SURFACE MODIFICATION; HYDROXYAPATITE COATINGS; PROTEIN ADSORPTION; TITANIUM IMPLANTS; CELL-INTERACTIONS; POLYETHERETHERKETONE; VITRO; OSSEOINTEGRATION; BIOACTIVITY;
D O I
10.1016/j.apsusc.2014.06.074
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Polyether ether ketone (PEEK) has a similar elastic modulus to bone and can be a suitable alternative to metallic implants. However, PEEK is bioinert and does not integrate well with the surrounding tissues. The current commercial method for solving this problem is by coating PEEK substrates with calcium phosphates via plasma spraying. However, this method produces a low bonding strength between the substrate and the coating layer, as well as non-uniform density of the coating. In this study, chemical deposition was used to deposit HA crystalline particles on PEEK substrate without any subsequent crystallisation process therefore producing crystalline treated layer. EDX results confirmed the deposition of HA, and the XRD results confirmed that the treated layer was crystalline HA. FT-IR analysis confirmed the chemical bonding between HA and the substrate. Surface roughness increased from 24.27 nm to 34.08 nm for 3 min immersion time. The water contact angle showed an increase in wettability of the treated sample from 71.6 to 36.4 degrees, which in turn increased its bioactivity. The proposed method is a suitable alternative to other conventional methods as high temperature was not involved in the process which could damage the surface of the substrate. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:1034 / 1040
页数:7
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